Patents by Inventor Veerapandian SELVARAJ

Veerapandian SELVARAJ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12180381
    Abstract: Disclosed are conductive liquid metal microparticles including a hydrogen-doped liquid metal oxide, a conductive ink including same, and a preparation method therefor. The conductive liquid metal microparticle includes a core containing a liquid metal and a shell surrounding the core and containing a hydrogen-doped liquid metal oxide. Since the conductive ink includes the liquid metal microparticles, with the use of the conductive ink, it is possible to form a circuit line exhibiting metal conductivity, an insignificant change in resistance when deformation or mechanical damage occurs, stability of electric characteristics under extreme environment, and good adhesion to an elastic substrate.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: December 31, 2024
    Assignee: POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Unyong Jeong, Veerapandian Selvaraj
  • Publication number: 20240199903
    Abstract: Disclosed are conductive liquid metal microparticles including a hydrogen-doped liquid metal oxide, a conductive ink including same, and a preparation method therefor. The conductive liquid metal microparticle includes a core containing a liquid metal and a shell surrounding the core and containing a hydrogen-doped liquid metal oxide. Since the conductive ink includes the liquid metal microparticles, with the use of the conductive ink, it is possible to form a circuit line exhibiting metal conductivity, an insignificant change in resistance when deformation or mechanical damage occurs, stability of electric characteristics under extreme environment, and good adhesion to an elastic substrate.
    Type: Application
    Filed: December 14, 2020
    Publication date: June 20, 2024
    Inventors: Unyong JEONG, Veerapandian SELVARAJ
  • Patent number: 11974393
    Abstract: Proposed are a flexible electrode circuit capable of being foamed through 3D circuit printing, a strain sensor using the same, and a manufacturing method thereof. The flexible electrode circuit includes a flexible substrate and an electrode foamed on the flexible substrate. The electrode includes a conductive line layer and a passivation layer. The conductive line layer includes a matrix including an elastic polymer and a conductive line having conductive liquid metal microparticles dispersed in the matrix. The passivation layer includes a coating portion coated on the conductive line and having an elastic polymer.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: April 30, 2024
    Assignee: POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Unyong Jeong, Veerapandian Selvaraj
  • Publication number: 20230044133
    Abstract: Proposed are a flexible electrode circuit capable of being foamed through 3D circuit printing, a strain sensor using the same, and a manufacturing method thereof. The flexible electrode circuit includes a flexible substrate and an electrode foamed on the flexible substrate. The electrode includes a conductive line layer and a passivation layer. The conductive line layer includes a matrix including an elastic polymer and a conductive line having conductive liquid metal microparticles dispersed in the matrix. The passivation layer includes a coating portion coated on the conductive line and having an elastic polymer.
    Type: Application
    Filed: December 14, 2020
    Publication date: February 9, 2023
    Inventors: Unyong JEONG, Veerapandian SELVARAJ