Patents by Inventor Venkat Dukkipati

Venkat Dukkipati has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Room temperature debonding composition, method and stack
    Patent number: 9117861
    Abstract: Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: August 25, 2015
    Inventors: Venkat Dukkipati, Kei Kawasaki, Larry Rhodes, Toshihiro Sato
  • Polymer compositions for temporary bonding
    Patent number: 9051452
    Abstract: Embodiments in accordance with the present invention are directed to poly(lactide) compositions that are useful for forming temporary bonding layers that serve to releasably join a first substrate to a second substrate as well as methods of both forming such a temporary bond and methods of debonding such substrates. Some such poly(lactide) compositions encompass a casting solvent, a photoacid generator and optionally a sensitizer and/or an adhesion promoter.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: June 9, 2015
    Assignee: PROMERUS, LLC
    Inventors: Larry F Rhodes, Leah J Langsdorf, Venkat Dukkipati
  • ROOM TEMPERATURE DEBONDING COMPOSITION, METHOD AND STACK
    Publication number: 20140178701
    Abstract: Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching.
    Type: Application
    Filed: February 27, 2014
    Publication date: June 26, 2014
    Applicants: SUMITOMO BAKELITE CO., LTD., PROMERUS, LLC
    Inventors: Venkat DUKKIPATI, Kei KAWASAKI, Larry RHODES, Toshihiro SATO
  • POLYMER COMPOSITIONS FOR TEMPORARY BONDING
    Publication number: 20140102631
    Abstract: Embodiments in accordance with the present invention are directed to poly(lactide) compositions that are useful for forming temporary bonding layers that serve to releasably join a first substrate to a second substrate as well as methods of both forming such a temporary bond and methods of debonding such substrates. Some such poly(lactide) compositions encompass a casting solvent, a photoacid generator and optionally a sensitizer and/or an adhesion promoter.
    Type: Application
    Filed: December 13, 2013
    Publication date: April 17, 2014
    Applicant: Promerus, LLC
    Inventors: Larry F. Rhodes, Leah J. Langsdorf, Venkat Dukkipati
  • Room temperature debonding composition, method and stack
    Patent number: 8696864
    Abstract: Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: April 15, 2014
    Assignees: Promerus, LLC, Sumitomo Bakelite Co., Ltd
    Inventors: Venkat Dukkipati, Kei Kawasaki, Larry F. Rhodes, Toshihiro Sato