Patents by Inventor Venkat K. BELAGURUSAMY

Venkat K. BELAGURUSAMY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10444045
    Abstract: Method, structure and system for capacitive sensing. A system includes: a two-dimensional electrode structure, where the two-dimensional sensing structure includes a channel for capacitive sensing, at least one integrated circuit connected to the two-dimensional electrodestructure and configured to mitigate external interference associated with the capacitive sensing by i) receiving an input signal from the two-dimensional electrode structure or ii) providing a select signal to the two-dimensional structure, and a data acquisition device connected to the two-dimensional electrode structure via the integrated circuit configuration and configured to receive an output signal from the integrated circuit.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: October 15, 2019
    Assignee: International Business Machines Corporation
    Inventors: Frank Libsch, Venkat K. Belagurusamy
  • Patent number: 10422672
    Abstract: A method, structure and system for capacitive sensing is provided. The structure includes: one or more first conductive lines arranged in a first arrangement in relation to a first substrate, one or more second conductive lines connected arranged in a second arrangement in relation to a second substrate, one or more first vias embedded on the first substrate and connecting one or more first electrodes to each respective one of the one or more first conductive lines; and one or more second vias embedded on the second substrate and connecting the one or more second electrodes to each respective one of the one or more second conductive lines, where the one or more first conductive electrodes and the second one or more electrodes are parallel and overlapping with respect to one another, and, where i) the first conductive electrodes and ii) the second conductive electrodes form a two-dimensional configuration.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: September 24, 2019
    Assignee: International Business Machines Corporation
    Inventors: Frank Libsch, Venkat K. Belagurusamy
  • Publication number: 20190277677
    Abstract: A method, structure and system for capacitive sensing is provided. The structure includes: one or more first conductive lines arranged in a first arrangement in relation to a first substrate, one or more second conductive lines connected arranged in a second arrangement in relation to a second substrate, one or more first vias embedded on the first substrate and connecting one or more first electrodes to each respective one of the one or more first conductive lines; and one or more second vias embedded on the second substrate and connecting the one or more second electrodes to each respective one of the one or more second conductive lines, where the one or more first conductive electrodes and the second one or more electrodes are parallel and overlapping with respect to one another, and, where i) the first conductive electrodes and ii) the second conductive electrodes form a two-dimensional configuration.
    Type: Application
    Filed: March 8, 2018
    Publication date: September 12, 2019
    Inventors: Frank LIBSCH, Venkat K. BELAGURUSAMY
  • Publication number: 20190277678
    Abstract: Method, structure and system for capacitive sensing. A system includes: a two-dimensional electrode structure, where the two-dimensional sensing structure includes a channel for capacitive sensing, at least one integrated circuit connected to the two-dimensional two-dimensional electrodestructure and configured to mitigate external interference associated with the capacitive sensing by i) receiving an input signal from the two-dimensional electrode structure or ii) providing a select signal to the two-dimensional structure, and a data acquisition device connected to the two-dimensional electrode structure via the integrated circuit configuration and configured to receive an output signal from the integrated circuit.
    Type: Application
    Filed: March 8, 2018
    Publication date: September 12, 2019
    Inventors: Frank LIBSCH, Venkat K. BELAGURUSAMY