Patents by Inventor Venkat Ramasubramanian

Venkat Ramasubramanian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8818785
    Abstract: A method for simulating a tucked transistor device having a diffusion region defined in a semiconductor layer, a gate electrode adjacent a first side of the diffusion region, a floating gate electrode adjacent a second side of the diffusion region, and an isolation structure disposed beneath at least a portion of the floating gate electrode is provided. The method includes receiving a first netlist having an entry for the tucked transistor device in a computing apparatus. The entry defines parameters associated with the gate electrode and the diffusion region. A parasitic capacitance component is added to the entry representing a gate capacitance between the floating gate and the diffusion region in the computing apparatus.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: August 26, 2014
    Assignees: GLOBALFOUNDRIES Inc., Advanced Micro Devices, Inc.
    Inventors: Jung-Suk Goo, Ciby Thuruthiyil, Venkat Ramasubramanian, John Faricelli
  • Publication number: 20130117002
    Abstract: A tucked transistor device has a diffusion region defined in a semiconductor layer, a switching gate electrode adjacent a first side of the diffusion region, a floating gate electrode adjacent a second side of the diffusion region, and an isolation structure disposed beneath at least a portion of the floating gate electrode. A method includes receiving a netlist having an entry for the tucked transistor device in a computing apparatus, the entry defining parameters associated with the switching gate electrode and the diffusion region, receiving a device parameter file including at least a gate bounded junction capacitance parameter that includes a junction capacitance bounded by the switching gate electrode modified to include a contribution of the floating gate electrode to a gate bounded junction capacitance of the tucked transistor device. Operation of the tucked transistor device is simulated in the computing apparatus using a transistor device model and the netlist.
    Type: Application
    Filed: November 3, 2011
    Publication date: May 9, 2013
    Applicants: ADVANCED MICRO DEVICES, INC., GLOBALFOUNDRIES INC.
    Inventors: Jung-Suk Goo, Ciby Thuruthiyil, Venkat Ramasubramanian, John Faricelli
  • Publication number: 20130117001
    Abstract: A method for simulating a tucked transistor device having a diffusion region defined in a semiconductor layer, a gate electrode adjacent a first side of the diffusion region, a floating gate electrode adjacent a second side of the diffusion region, and an isolation structure disposed beneath at least a portion of the floating gate electrode is provided. The method includes receiving a first netlist having an entry for the tucked transistor device in a computing apparatus. The entry defines parameters associated with the gate electrode and the diffusion region. A parasitic capacitance component is added to the entry representing a gate capacitance between the floating gate and the diffusion region in the computing apparatus.
    Type: Application
    Filed: November 3, 2011
    Publication date: May 9, 2013
    Applicants: ADVANCED MICRO DEVICES, INC., GLOBALFOUNDRIES INC.
    Inventors: Jung-Suk Goo, Ciby Thuruthiyil, Venkat Ramasubramanian, John Faricelli