Publication number: 20250210426
Abstract: Various techniques for alleviating crack formation and propagation in glass cores of microelectronic assemblies, and related devices and methods, are disclosed. The techniques are based on including fillers into glass cores and/or in layers provided on top and/or bottom of glass cores. The fillers have at least one characteristic indicative of material's resistance to breaking under stress being higher than that of glass, which may provide reinforcement and/or increase stiffness of glass, thereby strengthening glass cores. Examples of such characteristics include material strength, fracture toughness, or elastic modulus.
Type:
Application
Filed:
December 20, 2023
Publication date:
June 26, 2025
Applicant:
Intel Corporation
Inventors:
Bohan Shan, Mahdi Mohammadighaleni, Hiroki Tanaka, Kyle Jordan Arrington, Yiqun Bai, Whitney Bryks, Ryan Carrazzone, Haobo Chen, Gang Duan, Jeremy Ecton, Hongxia Feng, Xiaoying Guo, Shayan Kaviani, Ziyin Lin, Brandon C. Marin, Robert Alan May, Bin Mu, Bai Nie, Ala Omer, Srinivas Venkata Ramanuja Pietambaram, Dilan Seneviratne, Jose Waimin, Dingying Xu, Ehsan Zamani