Abstract: A magnetic write head for heat assisted magnetic recording having a novel heat sink structure. The write head includes a magnetic write pole and a thermal transducer located adjacent to a leading edge of the magnetic write pole. A heat sink structure, constructed of a non-magnetic, thermally conductive material such as Au, Ag or Cu partially surrounds the magnetic write pole. The heat sink structure can be formed to contact first and second sides of the magnetic write pole, and can be recessed from the media facing surface of the write head. The space between the heat sink structure and the media facing surface can be filled with a physically hard, non-corrosive metal.

Abstract: A method for manufacturing a magnetic write head having a heat sink structure, wherein the magnetic write head is free of voids at the media facing surface. After forming the write pole, a chemical mechanical polishing process is performed prior to defining the heat sink structure. Planarizing the write pole structure by chemical mechanical polishing prior to forming the heat sink structure advantageously reduces the topography over which the heat sink structure. This mitigates shadowing effects from the write pole structure and prevents the formation of voids at the media facing surface.

Abstract: A method for manufacturing a magnetic write head having a heat sink structure, wherein the magnetic write head is free of voids at the media facing surface. After forming the write pole, a chemical mechanical polishing process is performed prior to defining the heat sink structure. Planarizing the write pole structure by chemical mechanical polishing prior to forming the heat sink structure advantageously reduces the topography over which the heat sink structure. This mitigates shadowing effects from the write pole structure and prevents the formation of voids at the media facing surface.

Abstract: A magnetic write head for heat assisted magnetic recording having a novel heat sink structure. The write head includes a magnetic write pole and a thermal transducer located adjacent to a leading edge of the magnetic write pole. A heat sink structure, constructed of a non-magnetic, thermally conductive material such as Au, Ag or Cu partially surrounds the magnetic write pole. The heat sink structure can be formed to contact first and second sides of the magnetic write pole, and can be recessed from the media facing surface of the write head. The space between the heat sink structure and the media facing surface can be filled with a physically hard, non-corrosive metal.

Abstract: In one general embodiment, a magnetic head includes a stitch pole; and a main pole formed adjacent the stitch pole, wherein an end region of the stitch pole closest to an air bearing surface of the head tapers towards the main pole. In another general embodiment, a magnetic head includes a stitch pole being a laminate of at least two magnetic layers separated by a nonmagnetic layer; and a main pole formed adjacent the stitch pole. An end region of the stitch pole closest to an air bearing surface of the head tapers towards the main pole. An average angle of the taper of the end region of the stitch pole is between about 20 and about 45 degrees. Such head may be implemented in a data storage system.

Abstract: In one general embodiment, a magnetic head includes a stitch pole; and a main pole formed adjacent the stitch pole, wherein an end region of the stitch pole closest to an air bearing surface of the head tapers towards the main pole. In another general embodiment, a magnetic head includes a stitch pole being a laminate of at least two magnetic layers separated b a nonmagnetic layer; and a main pole formed adjacent the stitch pole. An end region of the stitch pole closest to an bearing surface of the bead tapers towards the main pole. An average angle of the taper of the end region of the stitch pole is between about 20 and about 45 degrees. Such head may be implemented in a data storage system.

Abstract: An aqueous composition for chemical mechanical planarization of a wafer or film using a fixed polishing pad, includes: