Abstract: Thin film photovoltaic devices including a transparent substrate defining a front surface area; a photovoltaic thin film stack on the transparent substrate; and, a back panel defining a rear surface area are provided. The photovoltaic thin film stack is positioned between the transparent substrate and the back panel. The front surface area can be less than the rear surface area (e.g., about 90% to about 99.9% of the rear surface area). As such, the back panel can extend farther than the transparent substrate along at least one edge of the device. An encapsulant layer defining an encapsulant surface area can be positioned between the photovoltaic thin film stack and the back panel. The encapsulant surface area can be greater than or equal to the front surface area or can be less than or equal to the rear surface area.

Abstract: Photovoltaic devices are provided that include: a transparent substrate; a plurality of thin film layers on the glass substrate; and, a first lead connected to one of the photovoltaic cells. An encapsulation substrate is positioned on the plurality of thin film layers, and defines a connection aperture through which the first lead extends. The connection aperture has a perimeter defined by an aperture wall of the encapsulation substrate. A support insert is positioned within the connection aperture to mechanically support the transparent substrate in the area of the connection aperture. The support insert is configured such that the first lead is able to extend through the connection aperture while the support insert in place within the connection aperture. A kit is also provided that includes an encapsulation substrate defining a connection aperture; and, a support insert configured to be coupled within the connection aperture of the encapsulation substrate.

Abstract: Methods are generally provided for adhering a support insert within a connection aperture defined in an encapsulating substrate of a photovoltaic device that has a first lead. The connection aperture generally has a perimeter defined by an aperture wall of the encapsulating substrate. The method can, in one particular embodiment, include threading the first lead through the connection aperture; and positioning a support insert within the connection aperture such that the first lead is still able to extend through the connection aperture. The support insert can generally define a channel within its construction that extends from a channel opening in the support insert to an exit port. An adhesive composition can be injected into the channel opening such that a first amount of the adhesive composition flows through the channel and out of the exit port to bond the support insert within the connection aperture.