Patents by Inventor Venkata Suresh GUTHIKONDA

Venkata Suresh GUTHIKONDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having sealant bridge
    Patent number: 11676873
    Abstract: Semiconductor packages having a sealant bridge between an integrated heat spreader and a package substrate are described. In an embodiment, a semiconductor package includes a sealant bridge anchoring the integrated heat spreader to the package substrate at locations within an overhang gap laterally between a semiconductor die and a sidewall of the integrated heat spreader. The sealant bridge extends between a top wall of the integrated heat spreader and a die side component, such as a functional electronic component or a non-functional component, or a satellite chip on the package substrate. The sealant bridge modulates warpage or stress in thermal interface material joints to reduce thermal degradation of the semiconductor package.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: June 13, 2023
    Assignee: Intel Corporation
    Inventors: Dinesh Padmanabhan Ramalekshmi Thanu, Hemanth K. Dhavaleswarapu, Venkata Suresh Guthikonda, John J. Beatty, Yonghao An, Marco Aurelio Cartas Ayala, Luke J. Garner, Peng Li
  • SEMICONDUCTOR PACKAGE HAVING SEALANT BRIDGE
    Publication number: 20200185290
    Abstract: Semiconductor packages having a sealant bridge between an integrated heat spreader and a package substrate are described. In an embodiment, a semiconductor package includes a sealant bridge anchoring the integrated heat spreader to the package substrate at locations within an overhang gap laterally between a semiconductor die and a sidewall of the integrated heat spreader. The sealant bridge extends between a top wall of the integrated heat spreader and a die side component, such as a functional electronic component or a non-functional component, or a satellite chip on the package substrate. The sealant bridge modulates warpage or stress in thermal interface material joints to reduce thermal degradation of the semiconductor package.
    Type: Application
    Filed: June 30, 2017
    Publication date: June 11, 2020
    Inventors: Dinesh PADMANABHAN RAMALEKSHMI THANU, Hemanth K. DHAVALESWARAPU, Venkata Suresh GUTHIKONDA, John J. BEATTY, Yonghao AN, Marco Aurelio CARTAS AYALA, Luke J. GARNER, Peng LI