Patents by Inventor Venkata Suresh R. GUTHIKONDA

Venkata Suresh R. GUTHIKONDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die back side structures for warpage control
    Patent number: 11322456
    Abstract: A foundation layer having a stiffener and methods of forming a stiffener are described. One or more dies are formed over the foundation layer. Each die has a front side surface that is electrically coupled to the foundation layer and a back side surface that is opposite from the front side surface. A stiffening layer (or a stiffener) is formed on the back side surface of at least one of the dies. The stiffening layer may be directly coupled to the back side surface of the one or more dies without an adhesive layer. The stiffening layer may include one or more materials, including at least one of a metal, a metal alloy, and a ceramic. The stiffening layer may be formed to reduce warpage based on the foundation layer and the dies. The one or more materials of the stiffening layer can be formed using a cold spray.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: May 3, 2022
    Assignee: Intel Corporation
    Inventors: Feras Eid, Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra M. Jha, Je-Young Chang, Kyle Yazzie, Prasanna Raghavan, Pramod Malatkar
  • DIE BACK SIDE STRUCTURES FOR WARPAGE CONTROL
    Publication number: 20200066655
    Abstract: A foundation layer having a stiffener and methods of forming a stiffener are described. One or more dies are formed over the foundation layer. Each die has a front side surface that is electrically coupled to the foundation layer and a back side surface that is opposite from the front side surface. A stiffening layer (or a stiffener) is formed on the back side surface of at least one of the dies. The stiffening layer may be directly coupled to the back side surface of the one or more dies without an adhesive layer. The stiffening layer may include one or more materials, including at least one of a metal, a metal alloy, and a ceramic. The stiffening layer may be formed to reduce warpage based on the foundation layer and the dies. The one or more materials of the stiffening layer can be formed using a cold spray.
    Type: Application
    Filed: June 30, 2017
    Publication date: February 27, 2020
    Inventors: Feras EID, Venkata Suresh R. GUTHIKONDA, Shankar DEVASENATHIPATHY, Chandra M. JHA, Je-Young CHANG, Kyle YAZZIE, Prasanna RAGHAVAN, Pramod MALATKAR
  • Constrained cure component attach process for improved IC package warpage control
    Patent number: 10290569
    Abstract: An apparatus, comprising a first platform comprising a first working surface having a first non-planar portion; and a second platform comprising a second working surface having a second non-planar portion, wherein: the second working surface is opposite the first working surface, a distance between the first working surface and the second working surface is adjustable, the first non-planar portion comprises a first curved portion, and the second non-planar portion comprises a second curved portion opposite the first curved portion.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: May 14, 2019
    Assignee: Intel Corporation
    Inventors: Kyle Yazzie, Venkata Suresh R. Guthikonda, Patrick Nardi, Santosh Sankarasubramanian, Kevin Y. Lin, Leigh M. Tribolet, John L. Harper, Pramod Malatkar
  • CONSTRAINED CURE COMPONENT ATTACH PROCESS FOR IMPROVED IC PACKAGE WARPAGE CONTROL
    Publication number: 20190103345
    Abstract: An apparatus, comprising a first platform comprising a first working surface having a first non-planar portion; and a second platform comprising a second working surface having a second non-planar portion, wherein: the second working surface is opposite the first working surface, a distance between the first working surface and the second working surface is adjustable, the first non-planar portion comprises a first curved portion, and the second non-planar portion comprises a second curved portion opposite the first curved portion.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 4, 2019
    Inventors: Kyle YAZZIE, Venkata Suresh R. GUTHIKONDA, Patrick NARDI, Santosh SANKARASUBRAMANIAN, Kevin Y. LIN, Leigh M. TRIBOLET, John L. HARPER, Pramod MALATKAR