Patents by Inventor Venkatanarayana SHANKARAMURTHY
Venkatanarayana SHANKARAMURTHY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11841692Abstract: A method includes identifying a recipe for depositing layers on a substrate in a processing chamber of a substrate processing system. The recipe comprises iterations of a set of one or more processes, and wherein each iteration of the iterations is for depositing at least one layer of the layers. The method further includes determining changes to parameters for depositing the at least one layer on the substrate. Each of the changes corresponds to a respective iteration of the iterations and is associated with a relative position of a corresponding layer. The layers are to be deposited on one or more substrates based on the recipe and the changes.Type: GrantFiled: September 16, 2022Date of Patent: December 12, 2023Assignee: Applied Materials, Inc.Inventors: Venkatanarayana Shankaramurthy, Anton Baryshnikov, Brett Berens, Mitesh Sanghvi, Shuang Liu
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Patent number: 11714430Abstract: A method includes identifying time values for a length of time to carry out process fluid delivery within multiple processing chambers that concurrently process multiple substrates; translating each time value to a recipe parameter for execution of an operation of a processing recipe; and causing the operation to be performed using each recipe parameter as a control value to control valves of a fluid panel of the multiple processing chambers. For each processing chamber of the multiple processing chambers, selectively controlling process fluid flow to the process chamber for a first period of time corresponding to a time value of the set of time values and to a divert foreline of the process chamber for a second period of time.Type: GrantFiled: September 29, 2022Date of Patent: August 1, 2023Assignee: Applied Materials, Inc.Inventors: Mitesh Sanghvi, Venkatanarayana Shankaramurthy, Peter Standish, Anton Baryshnikov, Thorsten Kril, Chahal Neema, Vishal Suresh Jamakhandi, Abhijit Ashok Kangude
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Publication number: 20230118964Abstract: A target concentration profile for a film to be deposited on a surface of a substrate during a deposition process for the substrate at a process chamber of a manufacturing system is identified. Data of the target concentration profile is processed using a model. The model outputs a set of deposition process settings that corresponds to the target concentration profile. One or more operations of the deposition process are performed in accordance with the set of deposition process settings.Type: ApplicationFiled: December 19, 2022Publication date: April 20, 2023Inventors: Anton V. Baryshnikov, Aykut Aydin, Zubin Huang, Rui Cheng, Yi Yang, Diwakar Kedlaya, Venkatanarayana Shankaramurthy, Krishna Nittala, Karthik Janakiraman
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Publication number: 20230021640Abstract: A method includes identifying time values for a length of time to carry out process fluid delivery within multiple processing chambers that concurrently process multiple substrates; translating each time value to a recipe parameter for execution of an operation of a processing recipe; and causing the operation to be performed using each recipe parameter as a control value to control valves of a fluid panel of the multiple processing chambers. For each processing chamber of the multiple processing chambers, selectively controlling process fluid flow to the process chamber for a first period of time corresponding to a time value of the set of time values and to a divert foreline of the process chamber for a second period of time.Type: ApplicationFiled: September 29, 2022Publication date: January 26, 2023Inventors: Mitesh Sanghvi, Venkatanarayana Shankaramurthy, Peter Standish, Anton Baryshnikov, Thorsten Kril, Chahal Neema, Vishal Suresh Jamakhandi, Abhijit Ashok Kangude
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Publication number: 20230014145Abstract: A method includes identifying a recipe for depositing layers on a substrate in a processing chamber of a substrate processing system. The recipe comprises iterations of a set of one or more processes, and wherein each iteration of the iterations is for depositing at least one layer of the layers. The method further includes determining changes to parameters for depositing the at least one layer on the substrate. Each of the changes corresponds to a respective iteration of the iterations and is associated with a relative position of a corresponding layer. The layers are to be deposited on one or more substrates based on the recipe and the changes.Type: ApplicationFiled: September 16, 2022Publication date: January 19, 2023Inventors: Venkatanarayana Shankaramurthy, Anton Baryshnikov, Brett Berens, Mitesh Sanghvi, Shuang Liu
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Patent number: 11532525Abstract: Methods and systems for controlling concentration profiles of deposited films using machine learning are provided. Data associated with a target concentration profile for a film to be deposited on a surface of a substrate during a deposition process for the substrate is provided as input to a trained machine learning model. One or more outputs of the trained machine learning model are obtained. Process recipe data identifying one or more sets of deposition process settings is determined from the one or more outputs. For each set of deposition process setting, an indication of a level of confidence that a respective set of deposition process settings corresponds to the target concentration profile for the film to be deposited on the substrate is also determined.Type: GrantFiled: March 3, 2021Date of Patent: December 20, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Anton V Baryshnikov, Aykut Aydin, Zubin Huang, Rui Cheng, Yi Yang, Diwakar Kedlaya, Venkatanarayana Shankaramurthy, Krishna Nittala, Karthik Janakiraman
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Patent number: 11487304Abstract: A method includes identifying time values for a length of time to carry out process fluid delivery within multiple processing chambers that concurrently process multiple substrates; translating each time value to a recipe parameter for execution of an operation of a processing recipe; and causing the operation to be performed using each recipe parameter as a control value to control valves of a fluid panel of the multiple processing chambers. For each processing chamber of the multiple processing chambers: causing the process fluid to flow to the processing chamber for a first period of time corresponding to a first time value; and causing the process fluid to flow to a divert foreline of the processing chamber for a second period of time, the second period of time being based on a timestep of the operation and the time value.Type: GrantFiled: January 8, 2021Date of Patent: November 1, 2022Assignee: Applied Materials, Inc.Inventors: Mitesh Sanghvi, Venkatanarayana Shankaramurthy, Peter Standish, Anton Baryshnikov, Thorsten Kril, Chahal Neema, Vishal Suresh Jamakhandi, Abhijit Ashok Kangude
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Patent number: 11449026Abstract: A method includes identifying a recipe for depositing a plurality of layers on a substrate in a processing chamber of a substrate processing system. The recipe includes iterations of a set of processes. Each iteration is for depositing at least one layer. The method further includes determining iteration adjustments to cause uniformity of the layers. Each iteration adjustment corresponds to a respective iteration. The method further includes determining multipliers to cause an adjustment in thickness of one or more layers of the layers. Each multiplier of the multipliers corresponds to a corresponding iteration. The method further includes storing the iteration adjustments and the multipliers as stored iteration adjustments and stored multipliers. The layers are deposited on substrates based on the recipe and the stored iteration adjustments and the stored multipliers.Type: GrantFiled: May 21, 2021Date of Patent: September 20, 2022Assignee: Applied Materials, Inc.Inventors: Venkatanarayana Shankaramurthy, Anton Baryshnikov, Brett Berens, Mitesh Sanghvi, Shuang Liu
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Publication number: 20220285232Abstract: Methods and systems for controlling concentration profiles of deposited films using machine learning are provided. Data associated with a target concentration profile for a film to be deposited on a surface of a substrate during a deposition process for the substrate is provided as input to a trained machine learning model. One or more outputs of the trained machine learning model are obtained. Process recipe data identifying one or more sets of deposition process settings is determined from the one or more outputs. For each set of deposition process setting, an indication of a level of confidence that a respective set of deposition process settings corresponds to the target concentration profile for the film to be deposited on the substrate is also determined.Type: ApplicationFiled: March 3, 2021Publication date: September 8, 2022Inventors: Anton V. Baryshnikov, Aykut Aydin, Zubin Huang, Rui Cheng, Yi Yang, Diwakar Kedlaya, Venkatanarayana Shankaramurthy, Krishna Nittala, Karthik Janakiraman
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Publication number: 20220221880Abstract: A method includes identifying time values for a length of time to carry out process fluid delivery within multiple processing chambers that concurrently process multiple substrates; translating each time value to a recipe parameter for execution of an operation of a processing recipe; and causing the operation to be performed using each recipe parameter as a control value to control valves of a fluid panel of the multiple processing chambers. For each processing chamber of the multiple processing chambers: causing the process fluid to flow to the processing chamber for a first period of time corresponding to a first time value; and causing the process fluid to flow to a divert foreline of the processing chamber for a second period of time, the second period of time being based on a timestep of the operation and the time value.Type: ApplicationFiled: January 8, 2021Publication date: July 14, 2022Inventors: Mitesh Sanghvi, Venkatanarayana Shankaramurthy, Peter Standish, Anton Baryshnikov, Thorsten Kril, Chahal Neema, Vishal Suresh Jamakhandi, Abhijit Ashok Kangude
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Publication number: 20210373523Abstract: A method includes identifying a recipe for depositing a plurality of layers on a substrate in a processing chamber of a substrate processing system. The recipe includes iterations of a set of processes. Each iteration is for depositing at least one layer. The method further includes determining iteration adjustments to cause uniformity of the layers. Each iteration adjustment corresponds to a respective iteration. The method further includes determining multipliers to cause an adjustment in thickness of one or more layers of the layers. Each multiplier of the multipliers corresponds to a corresponding iteration. The method further includes storing the iteration adjustments and the multipliers as stored iteration adjustments and stored multipliers. The layers are deposited on substrates based on the recipe and the stored iteration adjustments and the stored multipliers.Type: ApplicationFiled: May 21, 2021Publication date: December 2, 2021Inventors: Venkatanarayana Shankaramurthy, Anton Baryshnikov, Brett Berens, Mitesh Sanghvi, Shuang Liu
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Publication number: 20210320027Abstract: Exemplary methods of semiconductor processing may include coupling a fluid conduit within a substrate support in a semiconductor processing chamber to a system foreline. The coupling may vacuum chuck a substrate with the substrate support. The methods may include flowing a gas into the fluid conduit. The methods may include maintaining a pressure between the substrate and the substrate support at a pressure higher than the pressure at the system foreline.Type: ApplicationFiled: April 9, 2020Publication date: October 14, 2021Applicant: Applied Materials, Inc.Inventors: Zubin Huang, Rui Cheng, Diwakar Kedlaya, Satish Radhakrishnan, Anton V. Baryshnikov, Venkatanarayana Shankaramurthy, Karthik Janakiraman, Paul L. Brillhart, Badri N. Ramamurthi
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Patent number: 11031262Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.Type: GrantFiled: April 2, 2020Date of Patent: June 8, 2021Assignee: Applied Materials, Inc.Inventors: Saptarshi Basu, Jeongmin Lee, Paul Connors, Dale R. Du Bois, Prashant Kumar Kulshreshtha, Karthik Thimmavajjula Narasimha, Brett Berens, Kalyanjit Ghosh, Jianhua Zhou, Ganesh Balasubramanian, Kwangduk Douglas Lee, Juan Carlos Rocha-Alvarez, Hiroyuki Ogiso, Liliya Krivulina, Rick Gilbert, Mohsin Waqar, Venkatanarayana Shankaramurthy, Hari K. Ponnekanti
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Publication number: 20200234982Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.Type: ApplicationFiled: April 2, 2020Publication date: July 23, 2020Inventors: Saptarshi BASU, Jeongmin LEE, Paul CONNORS, Dale R. DU BOIS, Prashant Kumar KULSHRESHTHA, Karthik Thimmavajjula NARASIMHA, Brett BERENS, Kalyanjit GHOSH, Jianhua ZHOU, Ganesh BALASUBRAMANIAN, Kwangduk Douglas LEE, Juan Carlos ROCHA-ALVAREZ, Hiroyuki OGISO, Liliya KRIVULINA, Rick GILBERT, Mohsin WAQAR, Venkatanarayana SHANKARAMURTHY, Hari K. PONNEKANTI
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Patent number: 10636684Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.Type: GrantFiled: August 14, 2019Date of Patent: April 28, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Saptarshi Basu, Jeongmin Lee, Paul Connors, Dale R. Du Bois, Prashant Kumar Kulshreshtha, Karthik Thimmavajjula Narasimha, Brett Berens, Kalyanjit Ghosh, Jianhua Zhou, Ganesh Balasubramanian, Kwangduk Douglas Lee, Juan Carlos Rocha-Alvarez, Hiroyuki Ogiso, Liliya Krivulina, Rick Gilbert, Mohsin Waqar, Venkatanarayana Shankaramurthy, Hari K. Ponnekanti
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Publication number: 20190371630Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.Type: ApplicationFiled: August 14, 2019Publication date: December 5, 2019Inventors: Saptarshi Basu, Jeongmin Lee, Paul Connors, Dale R. Du Bois, Prashant Kumar Kulshreshtha, Karthik Thimmavajjula Narasimha, Brett Berens, Kalyanjit Ghosh, Jianhua Zhou, Ganesh Balasubramanian, Kwangduk Douglas Lee, Juan Carlos Rocha-Alvarez, Hiroyuki Ogiso, Liliya Krivulina, Rick Gilbert, Mohsin Waqar, Venkatanarayana Shankaramurthy, Hari K. Ponnekanti
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Patent number: 10403515Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.Type: GrantFiled: February 2, 2016Date of Patent: September 3, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Saptarshi Basu, Jeongmin Lee, Paul Connors, Dale R. Du Bois, Prashant Kumar Kulshreshtha, Karthik Thimmavajjula Narasimha, Brett Berens, Kalyanjit Ghosh, Jianhua Zhou, Ganesh Balasubramanian, Kwangduk Douglas Lee, Juan Carlos Rocha-Alvarez, Hiroyuki Ogiso, Liliya Krivulina, Rick Gilbert, Mohsin Waqar, Venkatanarayana Shankaramurthy, Hari K. Ponnekanti
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Publication number: 20170092511Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.Type: ApplicationFiled: February 2, 2016Publication date: March 30, 2017Inventors: Saptarshi BASU, Jeongmin LEE, Paul CONNORS, Dale R. DU BOIS, Prashant Kumar KULSHRESHTHA, Karthik Thimmavajjula NARASIMHA, Brett BERENS, Kalyanjit GHOSH, Jianhua ZHOU, Ganesh BALASUBRAMANIAN, Kwangduk Douglas LEE, Juan Carlos ROCHA-ALVAREZ, Hiroyuki OGISO, Liliya KRIVULINA, Rick GILBERT, Mohsin WAQAR, Venkatanarayana SHANKARAMURTHY, Hari K. PONNEKANTI