Abstract: The present invention relates to a silver-containing aqueous ink formulation for production of electrically conductive structures, wherein the formulation is provided in the form of a two-component system composed of a vehicle component A at least comprising an organic solvent, additives and water, and a silver nanoparticle sol as component B, at least comprising a liquid dispersant, stabilized silver nanoparticles and an electrostatic dispersion stabilizer, and the formulation composed of components A and B comprises at least a) 1-50% by weight of organic solvent, b) 0.005-12% by weight of additives, and c) 40-70% by weight of water, and d) 15-50% by weight of electrostatically stabilized silver nanoparticles, where the sum of the total proportions in the ink formulation adds up to 100% by weight in each case.

Abstract: An electrically conductive printable composition comprises silver particles, a dispersing agent, a solvent, a first surfactant, comprising a hydrocarbon based surfactant, and a second surfactant, comprising a fluoro-based surfactant.

Abstract: The invention is directed to a method of chemically-mechanically polishing a surface of a substrate, comprising contacting a surface of a substrate comprising nickel-phosphorous with a chemical-mechanical polishing composition comprising wet-process silica, an agent that oxidizes nickel-phosphorous, and an aminopolycarboxylic acid, wherein the polishing composition has a pH of about 1 to about 5, and abrading at least a portion of the nickel-phosphorous to polish the substrate.

Abstract: The invention is directed to a method of chemically-mechanically polishing a a surface of a substrate, comprising contacting a surface of a substrate comprising nickel-phosphorous with a chemical-mechanical polishing composition comprising wet-process silica, an agent that oxidizes nickel-phosphorous, and an aminopolycarboxylic acid, wherein the polishing composition has a pH of about 1 to about 5, and abrading at least a portion of the nickel-phosphorous to polish the substrate.

Abstract: A method of forming a desired conductive trace layout on a substrate, comprising the steps of: printing an organometallic compound onto the substrate in the desired conductive trace layout using a printer, the organometallic compound substantially transparent to electromagnetic radiation which is at least in part absorbed by the substrate; heating the substrate near or at an interface area of the organometallic compound and the substrate using the electromagnetic radiation; and, depositing at least part of the conductive trace on the substrate near or at the heated interface area as a result of the heating step.