Patents by Inventor Venkatesh Sundraram

Venkatesh Sundraram has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-band RF transceiver with passive reuse in organic substrates
    Patent number: 7489914
    Abstract: The present invention allows for the use of chip-package co-design of RF transceivers and their components by using discrete active devices in conjunction with passive components. Two particular components are described, including voltage controlled oscillators (VCOs) and low noise amplifiers (LNAs). The high quality passive components for use in the VCOs and LNAs may be obtained by the use of embedded passives in organic substrates. Further, the embedded passives may have multi-band characteristics, thereby allowing multi-band VCOs and LNAs to be implemented with fewer components. In situations where size is a concern, the active devices and passive components utilized in an RF transceiver may be implemented in a low form factor module of less than 1.1 mm thick according to an embodiment of the invention.
    Type: Grant
    Filed: April 25, 2005
    Date of Patent: February 10, 2009
    Assignee: Georgia Tech Research Corporation
    Inventors: Vinu Govind, Sidharth Dalmia, Amit Bavisi, Venkatesh Sundraram, Madhavan Swaminathan, George White
  • Multi-band RF transceiver with passive reuse in organic substrates
    Publication number: 20050248418
    Abstract: The present invention allows for the use of chip-package co-design of RF transceivers and their components by using discrete active devices in conjunction with passive components. Two particular components are described, including voltage controlled oscillators (VCOs) and low noise amplifiers (LNAs). The high quality passive components for use in the VCOs and LNAs may be obtained by the use of embedded passives in organic substrates. Further, the embedded passives may have multi-band characteristics, thereby allowing multi-band VCOs and LNAs to be implemented with fewer components. In situations where size is a concern, the active devices and passive components utilized in an RF transceiver may be implemented in a low form factor module of less than 1.1 mm thick according to an embodiment of the invention.
    Type: Application
    Filed: April 25, 2005
    Publication date: November 10, 2005
    Inventors: Vinu Govind, Sidharth Dalmia, Amit Bavisi, Venkatesh Sundraram, Madhavan Swaminathan, George White