Patents by Inventor Venkatesha Narayanaswamy

Venkatesha Narayanaswamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210276235
    Abstract: Various embodiments disclosed relate to injection-molded or compression-molded articles. A method of injection molding or compression molding an article includes directing a shot of molten material into a mold cavity including a plurality of contacting substantially identical modular mesh parts to fill the mold cavity. The method also includes solidifying the shot of molten material to form the article including the plurality of modular mesh parts and the solidified shot of molten material. Various embodiments also provide parts machined from a block produced by various methods of injection molding or compression molding.
    Type: Application
    Filed: July 16, 2019
    Publication date: September 9, 2021
    Inventors: Arunachala PARAMESHWARA, Venkatesha NARAYANASWAMY, Lingshan WANG
  • Patent number: 10940816
    Abstract: A rail extension, comprising: a base extending from an end of the rail extension, wherein the base includes vehicle rail attachments configured to attach to a vehicle rail; a front member configured for attachment to a bumper beam; a body extending from the base to the front member; wherein the body comprises reinforcing members; wherein the body comprises a first polymeric material; wherein the reinforcing members comprise a second polymeric material.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: March 9, 2021
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Subhransu Sekhar Mohapatra, Krishna Kishore Gumpina, Somasekhar Bobba, Arunachala Parameshwara, Venkatesha Narayanaswamy
  • Publication number: 20210048185
    Abstract: Various embodiments disclosed relate to economic thermally conductive coatings. The present invention includes metal coatings suitable for use with luminaires that facilitate heat dissipation.
    Type: Application
    Filed: April 30, 2019
    Publication date: February 18, 2021
    Inventors: Remesh KUZHIKKALI, Arunachala PARAMESHWARA, Venkatesha NARAYANASWAMY, Franciscus Petrus Maria MERCX, François Guillaume Sébastien COURTECUISSE, Hans-Otto SCHLOTHAUER
  • Patent number: 10569729
    Abstract: A plastic energy absorption member (28) for an automobile bumper assembly (22) is disclosed. The plastic energy absorption member (28) includes a plastic crushable body (34) defining a first end and a second end opposite the first end along a length of the crushable body (34). The plastic energy absorption member (28) further includes a plastic first mounting portion (30) disposed proximate to the first end and monolithic with the plastic crushable body (34), the first mounting portion defining at least one first attachment member (38) configured to attach to the bumper (24), and a plastic second mounting portion (32) disposed proximate to the second end and monolithic with the plastic crushable body (34), the second mounting portion defining at least one second attachment member (42) configured to attach to the automobile rail (26). The energy absorption member (28) defines a plurality of voids (44) that each extend along at least a portion of the length of the crushable body (34).
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: February 25, 2020
    Assignee: SABIC Global Technologies B.V.
    Inventors: Dinesh Munjurulimana, Arunachala Parameshwara, Venkatesha Narayanaswamy, Dhanendra Nagwanshi, Matthew Michael Delaney
  • Patent number: 10480768
    Abstract: Luminaires are disclosed that are configured to emit LED illumination. Certain components of the luminaire can be assembled without the use of fasteners. Further, the luminaires can include a plastic heat sink that can be molded with other components of the luminaire.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: November 19, 2019
    Assignee: SABIC Global Technologies B.V.
    Inventors: Arunachala Parameshwara, Venkatesha Narayanaswamy, Remesh Kuzhikkali, Ramanand Singh
  • Publication number: 20190202387
    Abstract: A rail extension, comprising: a base extending from an end of the rail extension, wherein the base includes vehicle rail attachments configured to attach to a vehicle rail; a front member configured for attachment to a bumper beam; a body extending from the base to the front member; wherein the body comprises reinforcing members; wherein the body comprises a first polymeric material; wherein the reinforcing members comprise a second polymeric material.
    Type: Application
    Filed: March 7, 2019
    Publication date: July 4, 2019
    Inventors: Subhransu Sekhar Mohapatra, Krishna Kishore Gumpina, Somasekhar Bobba, Arunachala Parameshwara, Venkatesha Narayanaswamy
  • Patent number: 10272860
    Abstract: A rail extension system (16), comprising: a vehicle rail (60); a bumper beam (20); a polymeric rail extension (1) comprising: a base (2) extending from one end of the rail extension having vehicle attachment configured to attach to the vehicle rail (60); a front member 4) configured for attachment to the bumper beam (20); a body (5) extending from the base (2) to the front member (4); an aperture (100) extending from the base (2) to the front member (4); a connection member (102) attached to the bumper beam (20) and extending through the aperture (100) to attach to the vehicle rail (60).
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: April 30, 2019
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Subhransu Sekhar Mohapatra, Krishna Kishore Gumpina, Somasekhar Bobba, Arunachala Parameshwara, Venkatesha Narayanaswamy
  • Publication number: 20180363886
    Abstract: Luminaires and lighting system are disclosed. In one embodiment a luminaire includes a housing formed by a single non-metallic extruded piece, where the housing includes an outer wall and an inner wall, a reflector formed on or by an inner surface of the inner wall, and a retainer bracket disposed adjacent the reflector and configured to secure a light emitting element such that at least a portion of light emitted via the light emitting element reflects from the reflector.
    Type: Application
    Filed: December 22, 2016
    Publication date: December 20, 2018
    Inventors: Venkatesha NARAYANASWAMY, Dirk VELDMAN, Arunachala PARAMESHWARA, Remesh KUZHIKKALI, Nitesh Kumar SHET, Murugan ARUMUGAN, Rajkumar KARTHIKEYAN
  • Publication number: 20180290611
    Abstract: A plastic energy absorption member (28) for an automobile bumper assembly (22) is disclosed. The plastic energy absorption member (28) includes a plastic crushable body (34) defining a first end and a second end opposite the first end along a length of the crushable body (34). The plastic energy absorption member (28) further includes a plastic first mounting portion (30) disposed proximate to the first end and monolithic with the plastic crushable body (34), the first mounting portion defining at least one first attachment member (38) configured to attach to the bumper (24), and a plastic second mounting portion (32) disposed proximate to the second end and monolithic with the plastic crushable body (34), the second mounting portion defining at least one second attachment member (42) configured to attach to the automobile rail (26). The energy absorption member (28) defines a plurality of voids (44) that each extend along at least a portion of the length of the crushable body (34).
    Type: Application
    Filed: April 27, 2016
    Publication date: October 11, 2018
    Inventors: Dinesh MUNJURULIMANA, Arunachala PARAMESHWARA, Venkatesha NARAYANASWAMY, Dhanendra NAGWANSHI, Matthew Michael DELANEY
  • Publication number: 20180252402
    Abstract: Luminaires are disclosed that are configured to emit LED illumination. The luminaires can include a plastic heat sink that can include different fin geometries that provide different heat dissipation properties.
    Type: Application
    Filed: March 17, 2016
    Publication date: September 6, 2018
    Inventors: Arunachala PARAMESHWARA, Venkatesha NARAYANASWAMY, Remesh KUZHIKKALI, Ramanand SINGH
  • Publication number: 20180119941
    Abstract: Luminaires are disclosed that are configured to emit LED illumination. Certain components of the luminaire can be assembled without the use of fasteners. Further, the luminaires can include a plastic heat sink that can be molded with other components of the luminaire.
    Type: Application
    Filed: March 17, 2016
    Publication date: May 3, 2018
    Applicant: Sabic Global Technologies B.V.
    Inventors: Arunachala PARAMESHWARA, Venkatesha NARAYANASWAMY, Remesh KUZHIKKALI, Ramanand SINGH
  • Publication number: 20170217393
    Abstract: A rail extension system (16), comprising: a vehicle rail (60); a bumper beam (20); a polymeric rail extension (1) comprising: a base (2) extending from one end of the rail extension having vehicle attachment configured to attach to the vehicle rail (60); a front member 4) configured for attachment to the bumper beam (20); a body (5) extending from the base (2) to the front member (4); an aperture (100) extending from the base (2) to the front member (4); a connection member (102) attached to the bumper beam (20) and extending through the aperture (100) to attach to the vehicle rail (60).
    Type: Application
    Filed: July 23, 2015
    Publication date: August 3, 2017
    Inventors: Subhransu Sekhar Mohapatra, Krishna Kishore Gumpina, Somasekhar Bobba, Arunachala Parameshwara, Venkatesha Narayanaswamy
  • Publication number: 20170043518
    Abstract: A method for forming a mold apparatus comprising: forming a cavity portion through an additive manufacturing process; wherein the cavity portion comprises a cavity molding surface having a surface roughness of greater than or equal to about 0.025 ?m and a plurality of cavity fluid channels; wherein the cavity fluid channels comprise a profile conforming to the profile of the cavity molding surface; treating the cavity molding surface to reduce the surface roughness to less than about 0.025 ?m; forming a core portion through additive manufacturing; wherein the core portion comprises a core molding surface and a plurality of core fluid channels; wherein the core fluid channels conform to the core molding surface.
    Type: Application
    Filed: April 23, 2015
    Publication date: February 16, 2017
    Applicant: SABIC Global Technologies, B.V.
    Inventor: Venkatesha Narayanaswamy
  • Patent number: 8998458
    Abstract: In an embodiment, heat sink system can comprise: an integrally formed plastic heat sink and a printed circuit board package, wherein the plastic heat sink comprises a thermally conductive plastic having a thermal conductivity of at least 1.0 W/mK. In another embodiment, hybrid heat sink system, comprising: an integrally formed plastic heat sink and an insert, wherein the plastic heat sink comprises a thermally conductive plastic, the plastic heat sink and the insert each having a cylindrical shape, and wherein the insert comprises a feature of lancing provisions, corrugations, embossing, holes, or a combination comprising at least one of the foregoing features.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: April 7, 2015
    Assignee: Sabic Global Technologies B.V.
    Inventors: Triloka Chander Tankala, Venkatesha Narayanaswamy, Arunachala Parameshwara, Poovanna Theethira Kushalappa, Seongnam Kang
  • Patent number: 8643492
    Abstract: Encapsulated radio frequency identification (RFID) articles having enhanced break strength and/or temperature resistance and methods of making these articles. The RFID articles include an RFID tag embedded within a thermoplastic substrate to form the RFID article. In one embodiment, the RFID article includes an over-molded barrier material that enables the RFID article to have enhanced temperature resistance such that the articles are able top sustain repeated exposure to high temperatures and/or sterilization procedures, thereby enabling the RFID articles to be utilized in applications heretofore unavailable. In other embodiments, the RFID articles are made using an injection molding process that provides very thin encapsulated RFID tags that also exhibit an increased level of temperature resistance.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: February 4, 2014
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Sudhakar R. Marur, Theethira Kushalappa Poovanna, Venkatesha Narayanaswamy
  • Publication number: 20120318877
    Abstract: Encapsulated radio frequency identification (RFID) articles having enhanced break strength and/or temperature resistance and methods of making these articles. The RFID articles include an RFID tag embedded within a thermoplastic substrate to form the RFID article. In one embodiment, the RFID article includes an over-molded barrier material that enables the RFID article to have enhanced temperature resistance such that the articles are able top sustain repeated exposure to high temperatures and/or sterilization procedures, thereby enabling the RFID articles to be utilized in applications heretofore unavailable. In other embodiments, the RFID articles are made using an injection molding process that provides very thin encapsulated RFID tags that also exhibit an increased level of temperature resistance.
    Type: Application
    Filed: August 30, 2012
    Publication date: December 20, 2012
    Applicant: SABIC INNOVATIVE PLASTICS IP B.V.
    Inventors: Sudhakar R. Marur, Theethira Kushalappa Poovanna, Venkatesha Narayanaswamy
  • Patent number: D776022
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: January 10, 2017
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Subhransu Sekhar Mohapatra, Arunachala Parameshwara, Venkatesha Narayanaswamy
  • Patent number: D803113
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: November 21, 2017
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Dinesh Munjurulimana, Arunachala Parameshwara, Venkatesha Narayanaswamy, Dhanendra Nagwanshi, Matthew M. Delaney
  • Patent number: D835550
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: December 11, 2018
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Subhransu Sekhar Mohapatra, Arunachala Parameshwara, Venkatesha Narayanaswamy
  • Patent number: D854468
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: July 23, 2019
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Dinesh Munjurulimana, Arunachala Parameshwara, Venkatesha Narayanaswamy, Dhanendra Nagwanshi, Matthew M. Delaney