Patents by Inventor Venkatesha Narayanaswamy
Venkatesha Narayanaswamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210276235Abstract: Various embodiments disclosed relate to injection-molded or compression-molded articles. A method of injection molding or compression molding an article includes directing a shot of molten material into a mold cavity including a plurality of contacting substantially identical modular mesh parts to fill the mold cavity. The method also includes solidifying the shot of molten material to form the article including the plurality of modular mesh parts and the solidified shot of molten material. Various embodiments also provide parts machined from a block produced by various methods of injection molding or compression molding.Type: ApplicationFiled: July 16, 2019Publication date: September 9, 2021Inventors: Arunachala PARAMESHWARA, Venkatesha NARAYANASWAMY, Lingshan WANG
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Patent number: 10940816Abstract: A rail extension, comprising: a base extending from an end of the rail extension, wherein the base includes vehicle rail attachments configured to attach to a vehicle rail; a front member configured for attachment to a bumper beam; a body extending from the base to the front member; wherein the body comprises reinforcing members; wherein the body comprises a first polymeric material; wherein the reinforcing members comprise a second polymeric material.Type: GrantFiled: March 7, 2019Date of Patent: March 9, 2021Assignee: SABIC GLOBAL TECHNOLOGIES B.V.Inventors: Subhransu Sekhar Mohapatra, Krishna Kishore Gumpina, Somasekhar Bobba, Arunachala Parameshwara, Venkatesha Narayanaswamy
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Publication number: 20210048185Abstract: Various embodiments disclosed relate to economic thermally conductive coatings. The present invention includes metal coatings suitable for use with luminaires that facilitate heat dissipation.Type: ApplicationFiled: April 30, 2019Publication date: February 18, 2021Inventors: Remesh KUZHIKKALI, Arunachala PARAMESHWARA, Venkatesha NARAYANASWAMY, Franciscus Petrus Maria MERCX, François Guillaume Sébastien COURTECUISSE, Hans-Otto SCHLOTHAUER
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Patent number: 10569729Abstract: A plastic energy absorption member (28) for an automobile bumper assembly (22) is disclosed. The plastic energy absorption member (28) includes a plastic crushable body (34) defining a first end and a second end opposite the first end along a length of the crushable body (34). The plastic energy absorption member (28) further includes a plastic first mounting portion (30) disposed proximate to the first end and monolithic with the plastic crushable body (34), the first mounting portion defining at least one first attachment member (38) configured to attach to the bumper (24), and a plastic second mounting portion (32) disposed proximate to the second end and monolithic with the plastic crushable body (34), the second mounting portion defining at least one second attachment member (42) configured to attach to the automobile rail (26). The energy absorption member (28) defines a plurality of voids (44) that each extend along at least a portion of the length of the crushable body (34).Type: GrantFiled: April 27, 2016Date of Patent: February 25, 2020Assignee: SABIC Global Technologies B.V.Inventors: Dinesh Munjurulimana, Arunachala Parameshwara, Venkatesha Narayanaswamy, Dhanendra Nagwanshi, Matthew Michael Delaney
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Patent number: 10480768Abstract: Luminaires are disclosed that are configured to emit LED illumination. Certain components of the luminaire can be assembled without the use of fasteners. Further, the luminaires can include a plastic heat sink that can be molded with other components of the luminaire.Type: GrantFiled: March 17, 2016Date of Patent: November 19, 2019Assignee: SABIC Global Technologies B.V.Inventors: Arunachala Parameshwara, Venkatesha Narayanaswamy, Remesh Kuzhikkali, Ramanand Singh
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Publication number: 20190202387Abstract: A rail extension, comprising: a base extending from an end of the rail extension, wherein the base includes vehicle rail attachments configured to attach to a vehicle rail; a front member configured for attachment to a bumper beam; a body extending from the base to the front member; wherein the body comprises reinforcing members; wherein the body comprises a first polymeric material; wherein the reinforcing members comprise a second polymeric material.Type: ApplicationFiled: March 7, 2019Publication date: July 4, 2019Inventors: Subhransu Sekhar Mohapatra, Krishna Kishore Gumpina, Somasekhar Bobba, Arunachala Parameshwara, Venkatesha Narayanaswamy
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Patent number: 10272860Abstract: A rail extension system (16), comprising: a vehicle rail (60); a bumper beam (20); a polymeric rail extension (1) comprising: a base (2) extending from one end of the rail extension having vehicle attachment configured to attach to the vehicle rail (60); a front member 4) configured for attachment to the bumper beam (20); a body (5) extending from the base (2) to the front member (4); an aperture (100) extending from the base (2) to the front member (4); a connection member (102) attached to the bumper beam (20) and extending through the aperture (100) to attach to the vehicle rail (60).Type: GrantFiled: July 23, 2015Date of Patent: April 30, 2019Assignee: SABIC GLOBAL TECHNOLOGIES B.V.Inventors: Subhransu Sekhar Mohapatra, Krishna Kishore Gumpina, Somasekhar Bobba, Arunachala Parameshwara, Venkatesha Narayanaswamy
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Publication number: 20180363886Abstract: Luminaires and lighting system are disclosed. In one embodiment a luminaire includes a housing formed by a single non-metallic extruded piece, where the housing includes an outer wall and an inner wall, a reflector formed on or by an inner surface of the inner wall, and a retainer bracket disposed adjacent the reflector and configured to secure a light emitting element such that at least a portion of light emitted via the light emitting element reflects from the reflector.Type: ApplicationFiled: December 22, 2016Publication date: December 20, 2018Inventors: Venkatesha NARAYANASWAMY, Dirk VELDMAN, Arunachala PARAMESHWARA, Remesh KUZHIKKALI, Nitesh Kumar SHET, Murugan ARUMUGAN, Rajkumar KARTHIKEYAN
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Publication number: 20180290611Abstract: A plastic energy absorption member (28) for an automobile bumper assembly (22) is disclosed. The plastic energy absorption member (28) includes a plastic crushable body (34) defining a first end and a second end opposite the first end along a length of the crushable body (34). The plastic energy absorption member (28) further includes a plastic first mounting portion (30) disposed proximate to the first end and monolithic with the plastic crushable body (34), the first mounting portion defining at least one first attachment member (38) configured to attach to the bumper (24), and a plastic second mounting portion (32) disposed proximate to the second end and monolithic with the plastic crushable body (34), the second mounting portion defining at least one second attachment member (42) configured to attach to the automobile rail (26). The energy absorption member (28) defines a plurality of voids (44) that each extend along at least a portion of the length of the crushable body (34).Type: ApplicationFiled: April 27, 2016Publication date: October 11, 2018Inventors: Dinesh MUNJURULIMANA, Arunachala PARAMESHWARA, Venkatesha NARAYANASWAMY, Dhanendra NAGWANSHI, Matthew Michael DELANEY
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Publication number: 20180252402Abstract: Luminaires are disclosed that are configured to emit LED illumination. The luminaires can include a plastic heat sink that can include different fin geometries that provide different heat dissipation properties.Type: ApplicationFiled: March 17, 2016Publication date: September 6, 2018Inventors: Arunachala PARAMESHWARA, Venkatesha NARAYANASWAMY, Remesh KUZHIKKALI, Ramanand SINGH
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Publication number: 20180119941Abstract: Luminaires are disclosed that are configured to emit LED illumination. Certain components of the luminaire can be assembled without the use of fasteners. Further, the luminaires can include a plastic heat sink that can be molded with other components of the luminaire.Type: ApplicationFiled: March 17, 2016Publication date: May 3, 2018Applicant: Sabic Global Technologies B.V.Inventors: Arunachala PARAMESHWARA, Venkatesha NARAYANASWAMY, Remesh KUZHIKKALI, Ramanand SINGH
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Publication number: 20170217393Abstract: A rail extension system (16), comprising: a vehicle rail (60); a bumper beam (20); a polymeric rail extension (1) comprising: a base (2) extending from one end of the rail extension having vehicle attachment configured to attach to the vehicle rail (60); a front member 4) configured for attachment to the bumper beam (20); a body (5) extending from the base (2) to the front member (4); an aperture (100) extending from the base (2) to the front member (4); a connection member (102) attached to the bumper beam (20) and extending through the aperture (100) to attach to the vehicle rail (60).Type: ApplicationFiled: July 23, 2015Publication date: August 3, 2017Inventors: Subhransu Sekhar Mohapatra, Krishna Kishore Gumpina, Somasekhar Bobba, Arunachala Parameshwara, Venkatesha Narayanaswamy
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Publication number: 20170043518Abstract: A method for forming a mold apparatus comprising: forming a cavity portion through an additive manufacturing process; wherein the cavity portion comprises a cavity molding surface having a surface roughness of greater than or equal to about 0.025 ?m and a plurality of cavity fluid channels; wherein the cavity fluid channels comprise a profile conforming to the profile of the cavity molding surface; treating the cavity molding surface to reduce the surface roughness to less than about 0.025 ?m; forming a core portion through additive manufacturing; wherein the core portion comprises a core molding surface and a plurality of core fluid channels; wherein the core fluid channels conform to the core molding surface.Type: ApplicationFiled: April 23, 2015Publication date: February 16, 2017Applicant: SABIC Global Technologies, B.V.Inventor: Venkatesha Narayanaswamy
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Patent number: 8998458Abstract: In an embodiment, heat sink system can comprise: an integrally formed plastic heat sink and a printed circuit board package, wherein the plastic heat sink comprises a thermally conductive plastic having a thermal conductivity of at least 1.0 W/mK. In another embodiment, hybrid heat sink system, comprising: an integrally formed plastic heat sink and an insert, wherein the plastic heat sink comprises a thermally conductive plastic, the plastic heat sink and the insert each having a cylindrical shape, and wherein the insert comprises a feature of lancing provisions, corrugations, embossing, holes, or a combination comprising at least one of the foregoing features.Type: GrantFiled: May 30, 2012Date of Patent: April 7, 2015Assignee: Sabic Global Technologies B.V.Inventors: Triloka Chander Tankala, Venkatesha Narayanaswamy, Arunachala Parameshwara, Poovanna Theethira Kushalappa, Seongnam Kang
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Patent number: 8643492Abstract: Encapsulated radio frequency identification (RFID) articles having enhanced break strength and/or temperature resistance and methods of making these articles. The RFID articles include an RFID tag embedded within a thermoplastic substrate to form the RFID article. In one embodiment, the RFID article includes an over-molded barrier material that enables the RFID article to have enhanced temperature resistance such that the articles are able top sustain repeated exposure to high temperatures and/or sterilization procedures, thereby enabling the RFID articles to be utilized in applications heretofore unavailable. In other embodiments, the RFID articles are made using an injection molding process that provides very thin encapsulated RFID tags that also exhibit an increased level of temperature resistance.Type: GrantFiled: August 30, 2012Date of Patent: February 4, 2014Assignee: Sabic Innovative Plastics IP B.V.Inventors: Sudhakar R. Marur, Theethira Kushalappa Poovanna, Venkatesha Narayanaswamy
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Publication number: 20120318877Abstract: Encapsulated radio frequency identification (RFID) articles having enhanced break strength and/or temperature resistance and methods of making these articles. The RFID articles include an RFID tag embedded within a thermoplastic substrate to form the RFID article. In one embodiment, the RFID article includes an over-molded barrier material that enables the RFID article to have enhanced temperature resistance such that the articles are able top sustain repeated exposure to high temperatures and/or sterilization procedures, thereby enabling the RFID articles to be utilized in applications heretofore unavailable. In other embodiments, the RFID articles are made using an injection molding process that provides very thin encapsulated RFID tags that also exhibit an increased level of temperature resistance.Type: ApplicationFiled: August 30, 2012Publication date: December 20, 2012Applicant: SABIC INNOVATIVE PLASTICS IP B.V.Inventors: Sudhakar R. Marur, Theethira Kushalappa Poovanna, Venkatesha Narayanaswamy
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Patent number: D776022Type: GrantFiled: July 25, 2014Date of Patent: January 10, 2017Assignee: SABIC GLOBAL TECHNOLOGIES B.V.Inventors: Subhransu Sekhar Mohapatra, Arunachala Parameshwara, Venkatesha Narayanaswamy
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Patent number: D803113Type: GrantFiled: April 30, 2015Date of Patent: November 21, 2017Assignee: SABIC GLOBAL TECHNOLOGIES B.V.Inventors: Dinesh Munjurulimana, Arunachala Parameshwara, Venkatesha Narayanaswamy, Dhanendra Nagwanshi, Matthew M. Delaney
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Patent number: D835550Type: GrantFiled: November 29, 2016Date of Patent: December 11, 2018Assignee: SABIC GLOBAL TECHNOLOGIES B.V.Inventors: Subhransu Sekhar Mohapatra, Arunachala Parameshwara, Venkatesha Narayanaswamy
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Patent number: D854468Type: GrantFiled: October 13, 2017Date of Patent: July 23, 2019Assignee: SABIC GLOBAL TECHNOLOGIES B.V.Inventors: Dinesh Munjurulimana, Arunachala Parameshwara, Venkatesha Narayanaswamy, Dhanendra Nagwanshi, Matthew M. Delaney