Patents by Inventor Venugopala Rao Basava

Venugopala Rao Basava has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200123379
    Abstract: A toughened thermoplastic composition containing thermoplastic polyurethane, carbon nanostructures, and graphite microparticles coated with at least one metal. The toughened thermoplastic composition is an injectable moldable grade thermoplastic composition, with developed processing properties compatible with fused filament fabrication additive manufacturing, EMI shielding, and electrical grounding. The composition contains an electrically conductive polymer composite, the composite containing: at least one thermoplastic material containing thermoplastic polyurethane; at least one electrically conductive material containing carbon nanostructures; and at least one graphite microparticle coated with at least one metal.
    Type: Application
    Filed: October 23, 2018
    Publication date: April 23, 2020
    Applicant: Lockheed Martin Corporation
    Inventors: James A. WAICUKAUSKI, Venugopala Rao BASAVA
  • Publication number: 20200102453
    Abstract: An electrically conductive thermoplastic composition comprised of at least one thermoplastic polycarbonate/acrylonitrile-butadiene-styrene (PC/ABS) polymer, at least one electrically conductive material containing carbon nanostructures or nanomaterials, and optionally at least one ethylene/alkyl-(meth)acrylate copolymer. The conductive thermoplastic composition can be injection molded and/or printable using additive manufacturing techniques.
    Type: Application
    Filed: October 2, 2018
    Publication date: April 2, 2020
    Applicant: Lockheed Martin Corporation
    Inventors: James A. Waicukauski, Venugopala Rao Basava, Joseph Herbert Mills, Rikard K. Haraldsson, James Alan Gubisch