Patents by Inventor Verena Hein

Verena Hein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test structure for highly accelerated electromigration tests for thick metallization systems of solid state integrated circuits
    Patent number: 8836342
    Abstract: A test structure and a process for the electromigration test of integrated circuits is suggested, in which metallization planes consisting of strip conductors of a usual thickness (11) are connected with metallization planes consisting of substantially thicker strip conductors (12) as they are required for the connection of components of higher performance.
    Type: Grant
    Filed: October 19, 2007
    Date of Patent: September 16, 2014
    Assignee: X-FAB Semiconductor Foundries AG
    Inventor: Verena Hein
  • TEST STRUCTURE FOR HIGHLY ACCELERATED ELECTROMIGRATION TESTS FOR THICK METALLIZATION SYSTEMS OF SOLID INTEGRATED CIRCUITS
    Publication number: 20110037477
    Abstract: A test structure and a process for the electromigration test of integrated circuits is suggested, in which metallization planes consisting of strip conductors of a usual thickness (11) are connected with metallization planes consisting of substantially thicker strip conductors (12) as they are required for the connection of components of higher performance.
    Type: Application
    Filed: October 19, 2007
    Publication date: February 17, 2011
    Inventor: Verena Hein