Patents by Inventor Vergil R. SANDOVAL

Vergil R. SANDOVAL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145619
    Abstract: A wire bonding system attaches wires to a solar cell wafer. The wire bonding system includes a feed tube through which a wire is drawn. Rollers contact the wire through openings in the feed tube to facilitate movement of the wire. The wire bonding system includes a soldering heater tip and a wire cutter. The solar cell wafer is placed on a platform, which moves the solar cell wafer. The system has multiple lanes for attaching multiple wires to the solar cell wafer at the same time in parallel operations.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Applicant: MAXEON SOLAR PTE. LTD.
    Inventors: Vergil R. SANDOVAL, Emmanuel C. Abas, Yafu Lin
  • Patent number: 11894485
    Abstract: A wire bonding system attaches wires to a solar cell wafer. The wire bonding system includes a feed tube through which a wire is drawn. Rollers contact the wire through openings in the feed tube to facilitate movement of the wire. The wire bonding system includes a soldering heater tip and a wire cutter. The solar cell wafer is placed on a platform, which moves the solar cell wafer. The system has multiple lanes for attaching multiple wires to the solar cell wafer at the same time in parallel operations.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: February 6, 2024
    Assignee: Maxeon Solar Pte. Ltd
    Inventors: Vergil R. Sandoval, Emmanuel C. Abas, Yafu Lin
  • Publication number: 20220190190
    Abstract: A wire bonding system attaches wires to a solar cell wafer. The wire bonding system includes a feed tube through which a wire is drawn. Rollers contact the wire through openings in the feed tube to facilitate movement of the wire. The wire bonding system includes a soldering heater tip and a wire cutter. The solar cell wafer is placed on a platform, which moves the solar cell wafer. The system has multiple lanes for attaching multiple wires to the solar cell wafer at the same time in parallel operations.
    Type: Application
    Filed: September 28, 2021
    Publication date: June 16, 2022
    Applicant: Maxeon Solar Pte. Ltd
    Inventors: Vergil R. SANDOVAL, Emmanuel C. ABAS, Yafu LIN