Patents by Inventor Vermal Raja Manikam

Vermal Raja Manikam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for molding substrate
    Patent number: 8062424
    Abstract: A method for encapsulating a substrate includes placing a hardened encapsulant material in a container. The encapsulant material is then heated and stirred until it is in a liquid or gel state. The liquid encapsulant material is held in the container in a vacuum state and dispensed over semiconductor dies along a guide, which allows the liquid encapsulant material to cool slightly before it covers a die.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: November 22, 2011
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Vermal Raja Manikam, Boon Yew Low, Vittal Raja Manikam
  • METHOD AND APPARATUS FOR MOLDING SUBSTRATE
    Publication number: 20110115125
    Abstract: A method for encapsulating a substrate includes placing a hardened encapsulant material in a container. The encapsulant material is then heated and stirred until it is in a liquid or gel state. The liquid encapsulant material is held in the container in a vacuum state and dispensed over semiconductor dies along a guide, which allows the liquid encapsulant material to cool slightly before it covers a die.
    Type: Application
    Filed: November 13, 2009
    Publication date: May 19, 2011
    Applicant: FREESCALE SEMICONDUCTOR, INC
    Inventors: Vermal Raja MANIKAM, Boon Yew Low, Vittal Raja Manikam