Patents by Inventor Vern Hause

Vern Hause has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for securing a semiconductor chip to a leadframe
    Patent number: 5336639
    Abstract: A semiconductor chip (26) is attached to a leadframe (20, 30, 40). The leadframe (20, 30, 40) has an opening (24) or a cavity (34, 44) for receiving the semiconductor chip (26). The opening (24) or the cavity (34, 44) and the semiconductor chip (26) have corresponding shapes. The opening (24) or the cavity (34, 44) is made such that they are smaller than the size of the semiconductor chip (26) at room temperature. The opening (24) or the cavity (34, 44) is expanded and the semiconductor chip (26) is placed in the opening (24) or the cavity (34, 44). Subsequent to placing the semiconductor chip (26) in the opening (24) or the cavity (34, 44), the leadframe (20, 30, 40) is cooled so that an edge (25) of the leadframe grips a corresponding edge (29) of the semiconductor chip (26).
    Type: Grant
    Filed: June 28, 1993
    Date of Patent: August 9, 1994
    Assignee: Motorola, Inc.
    Inventors: Benamanahalli K. Nagaraj, Vern Hause