Abstract: Disclosed embodiments describe techniques for personal area network (PAN) enablement. PAIN connection uses an interconnection laminate substrate for connectivity of personal area network components. The interconnection laminate substrate may be flexible or rigid. In one preferred form of the invention, the interconnection laminate substrate is flexible. A plurality of personal area network components is provided. An interconnection laminate substrate is provided within a manufactured article (e.g., a soft good assembly), where the interconnection laminate substrate enables connectivity among the plurality of personal area network components, and where the interconnection laminate substrate comprises interconnection wiring encapsulated in at least one protective encapsulation layer, with the interconnection wiring being coupled to a plurality of exposed connectors.