Abstract: A semiconductor fabrication having thermal characteristics comparable to hybrid ceramic packages comprises a flexible copper foil printed circuit on a thin polyimide film layer thermally laminated to a metal surface, such as aluminum, with a high temperature thermal plastic, such as polyetherimide. A semiconductor die is attached to a relatively thick metal heat spreader which in turn is attached to at least a portion of the copper foil. The resultant structure is a semiconductor package which has a thermal performance comparable to that of typical hybrid ceramic packages.

Abstract: A molding process and resulting product is disclosed in which a printed circuit pattern carrier is placed in a mold and is molded to an insulation carrier. The insulation carrier is disclosed as a printed circuit board or the interior of the insulation housing for an electrical product. Plural laminations molded atop one another are disclosed. The printed circuit carrier has mold gate openings to enable molding of features which extend above the plane of the conductive layer. A printed circuit pattern is applied before the molding step.

Abstract: A molding process and resulting product is disclosed in which a printed circuit pattern carrier is placed in a mold and is molded to an insulation carrier. The insulation carrier is disclosed as a printed circuit board or the interior of the insulation housing for an electrical product. Plural laminations molded atop one another are disclosed. The printed circuit carrier has mold gate openings to enable molding of features which extend above the plane of the conductive layer. A printed circuit pattern is applied before the molding step.

Abstract: A one bit industrial control unit for executing a program of non-arithmetic instructions includes a one-bit bidirectional data conductor, a 4-bit instruction register and instruction decoder, and control logic coupled to the instruction decoder for generating control signals to effect execution of the non-arithmetic instructions. A logic unit having a first input coupled to the bidirectional data conductor, a second input, and an output is capable of performing logical AND, AND-complement, OR, OR-complement, and Exclusive NOR functions upon logical signals applied to its two inputs. A result register is coupled to the output of the logic unit. The output of the result register is fed back to the second input of the logic unit and is coupled by way of a write gate to the first input of the logic unit.