Patents by Inventor Vernon Knepprath

Vernon Knepprath has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for cutting wafers from a crystal
    Patent number: 5947102
    Abstract: A sawing suspension composition is composed of an essentially nonaqueous or anhydrous organic liquid in which hard-material particles are dispersed. The liquid is selected from a group of compounds which comprises low molecular weight polyglycols and any desired mixture of these polyglycols. The sawing suspension is used in conjunction with a wire saw for cutting wafers from a crystal of a brittle and hard material.
    Type: Grant
    Filed: August 12, 1997
    Date of Patent: September 7, 1999
    Assignee: Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
    Inventors: Vernon Knepprath, Walter Frank, Maximilian Kaeser, Albert Pemwieser