Abstract: Disclosed is a method for implementing a vacuum seal between an interface of a transport chamber interface port of a transport chamber and another chamber. The transport chamber being configured to mate with the another chamber in an adjacent relationship. The method includes placing an insert plate having a sealing surface containing a first O-ring into the transport chamber interface port such that the first O-ring is sandwiched between the sealing surface and a surface of the another chamber. Therefore, a vacuum seal is achieved between the transport chamber and the another chamber within the transport chamber interface port via the first O-ring.

Abstract: Disclosed is a method for implementing a vacuum seal between an interface of a transport chamber interface port of a transport chamber and another chamber. The transport chamber being configured to mate with the another chamber in an adjacent relationship. The method includes placing an insert plate having a sealing surface containing a first O-ring into the transport chamber interface port such that the first O-ring is sandwiched between the sealing surface and a surface of the another chamber. Therefore, a vacuum seal is achieved between the transport chamber and the another chamber within the transport chamber interface port via the first O-ring.

Abstract: A wafer clamping mechanism includes a clamp ring having a central opening corresponding to the geometry of a conventional semiconductor wafer. An overhang located about the opening engages the corresponding semiconductor wafer when in place on an electrode of a plasma reactor. The clamp ring is resiliently mounted on a housing which holds a second electrode. The clamp ring is automatically engaged against the wafer as the spacing between the two electrodes is adjusted to a desired gap width. A raised annular barrier on the lower electrode circumscribes the wafer and engages a mating surface on the clamp ring in order to enhance alignment of the clamp.