Patents by Inventor Veronika Theyerl

Veronika Theyerl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220148951
    Abstract: A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.
    Type: Application
    Filed: December 7, 2021
    Publication date: May 12, 2022
    Applicant: Infineon Technologies AG
    Inventors: Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Claus Waechter, Veronika Theyerl, Dominic Maier, Thomas Kilger, Saverio Trotta, Ashutosh Baheti, Georg Meyer-Berg, Maciej Wojnowski