Abstract: A testing device (100) is for electrically testing integrated circuits on a wafer (102). The testing device (100) includes a vacuum chamber (109), a chuck (101) for holding the wafer (102), a probe card (103) for electrically contacting the integrated circuits, and a radiation shield (107) arranged inside the vacuum chamber (109) and enclosing the chuck (101) and the probe card (103). In the testing device (100), the vacuum chamber (109) is provided with a gate valve (123), the radiation shield (107) is provided with a hatch (122), and the testing device (100) includes a wafer loading assembly (125) for loading the wafer (102) onto the chuck (101) through the gate valve (123) and the hatch (122).

Abstract: The present invention provides a testing device for electrically testing integrated circuits on a wafer. The testing device comprises a vacuum chamber, a chuck for holding the wafer, a probe card for electrically contacting the integrated circuits, means for moving the chuck relative to the probe card, a first radiation shield arranged inside the vacuum chamber and enclosing the chuck and the probe card, and a cooling unit thermally connected to the first radiation shield. The means for moving the chuck relative to the probe card comprises a supporting column having a first end and a second end, the first end of the supporting column being attached to the chuck, and the first radiation shield comprises a first fixed part having a first aperture through which the supporting column is arranged to pass, and a first movable part that is attached to the supporting column and arranged to cover the first aperture.

Abstract: The present invention provides a testing device for electrically testing integrated circuits on a wafer. The testing device comprises a vacuum chamber, a chuck for holding the wafer, a probe card for electrically contacting the integrated circuits, and a radiation shield arranged inside the vacuum chamber and enclosing the chuck and the probe card. In the testing device, the vacuum chamber is provided with a gate valve, the radiation shield is provided with a hatch, and the testing device comprises a wafer loading assembly for loading the wafer onto the chuck through the gate valve and the hatch.

Abstract: The present invention provides a testing device for electrically testing integrated circuits on a wafer. The testing device comprises a vacuum chamber, a chuck for holding the wafer, a probe card for electrically contacting the integrated circuits, means for moving the chuck relative to the probe card, a first radiation shield arranged inside the vacuum chamber and enclosing the chuck and the probe card, and a cooling unit thermally connected to the first radiation shield. The means for moving the chuck relative to the probe card comprises a supporting column having a first end and a second end, the first end of the supporting column being attached to the chuck, and the first radiation shield comprises a first fixed part having a first aperture through which the supporting column is arranged to pass, and a first movable part that is attached to the supporting column and arranged to cover the first aperture.

Abstract: A pressure testing apparatus for chips on a wafer has a pressure chamber, a support plate arranged between the upper and lower parts of the housing, a wafer chuck, a testing device and a positioning device. The wafer chuck, the testing device and the positioning device are supported to the support plate and arranged inside the pressure chamber. The support plate has, inside the pressure chamber, an opening providing a gas connection between the upper and lower parts of the housing.

Abstract: A pressure testing apparatus for chips on a wafer has a pressure chamber, a support plate arranged between the upper and lower parts of the housing, a wafer chuck, a testing means and a positioning device. The wafer chuck, the testing means and the positioning device are supported to the support plate and arranged inside the pressure chamber. The support plate has, inside the pressure chamber, an opening providing a gas connection between the upper and lower parts of the housing.

Abstract: The invention relates to an improved separation device in which a plate unit containing the filter comprises a separate abutment ring and a cassette which can be easily connected thereto, said cassette comprising at least one filter together with, if required, a frame belonging thereto so as to support the filter. If the filter consists of a flexible membrane, this is fitted into a special frame. However, if the filter is a rigid self-supporting filter of a porous material, for example, a ceramic filter or the like, a separate frame is not needed to support the filter.

Abstract: The invention concerns a method and a device for separation of separable constituents from a liquid medium. The separation device comprises only one cell or a stack of a plurality of adjacent cell, whereby each cell consists of a plate unit containing a filter, an inlet for supplying the liquid medium into a chamber, and outlet for discharging the reject and an outlet for discharging the permeate. The liquid medium is subjected to a strong turbulence created by a convenient designed rotor, possible combined with sound waves, whereby the deposition of separable constituents on the filter is prevented or essentially reduced.