Patents by Inventor Vester Ray Raynor

Vester Ray Raynor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for increasing the dielectric strength of isolated base integrated circuits used with variable frequency drives
    Patent number: 6625027
    Abstract: A heat sink structure increasing the dielectric strength of isolation for power integrated circuits is formed from a common layer on which laterally spaced isolated layers for each individual integrated circuit are mounted. At least the isolated layers are formed of anodized aluminum coated with aluminum oxide on exterior surfaces. The aluminum and aluminum oxide of the isolated layers provide good thermal conduction for heat dissipation while the electric isolation from the common electric potential of the common layer is improved, at least in part, by increasing the distance between the integrated circuits and the common layer. The heat sink structure may be mounted within a weatherproof enclosure with one externally exposed surface for heat dissipation.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: September 23, 2003
    Assignee: Baker Hughes Incorporated
    Inventors: Jerald Ray Rider, Vester Ray Raynor
  • Method for increasing the dielectric strength of isolated base integrated circuits used with variable frequency drives
    Publication number: 20030081384
    Abstract: A heat sink structure increasing the dielectric strength of isolation for power integrated circuits is formed from a common layer on which laterally spaced isolated layers for each individual integrated circuit are mounted. At least the isolated layers are formed of anodized aluminum coated with aluminum oxide on exterior surfaces. The aluminum and aluminum oxide of the isolated layers provide good thermal conduction for heat dissipation while the electric isolation from the common electric potential of the common layer is improved, at least in part, by increasing the distance between the integrated circuits and the common layer. The heat sink structure may be mounted within a weatherproof enclosure with one externally exposed surface for heat dissipation.
    Type: Application
    Filed: October 31, 2001
    Publication date: May 1, 2003
    Inventors: Jerald Ray Rider, Vester Ray Raynor