Abstract: A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

Abstract: In some embodiments, a fuel temperature sensor is located proximate to a vehicle component that is expected to experience fuel gelling, such as near or within a fuel filter, in order to obtain temperature information that accurately reflects the likelihood of fuel gelling occurring within the component. The proximate fuel temperature sensor can provide more accurate temperature information for components such as fuel filters that are installed at the periphery of the vehicle, compared to other temperature sensors that measure oil temperatures or other temperatures of centrally located vehicle components. In some embodiments, the vehicle is automatically started when the temperature indicated by the fuel temperature sensor falls below a startup temperature threshold value, and is automatically stopped after a predetermined time period or after the temperature reaches a shutdown temperature threshold value.

Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.

Abstract: A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

Abstract: This invention provides a polymer thick film electrically conductive paste composition, comprising conductive metal powder, a resin blend of polyol and phenoxy resin, blocked aliphatic polyisocyanate and one or more polar, aprotic solvents. In one embodiment the paste composition is used to form electrically conductive adhesive. In another embodiment the paste composition is used to form an electrically conductive polymer thick film.

Abstract: A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.

Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.

Abstract: In some embodiments, a fuel temperature sensor is located proximate to a vehicle component that is expected to experience fuel gelling, such as near or within a fuel filter, in order to obtain temperature information that accurately reflects the likelihood of fuel gelling occurring within the component. The proximate fuel temperature sensor can provide more accurate temperature information for components such as fuel filters that are installed at the periphery of the vehicle, compared to other temperature sensors that measure oil temperatures or other temperatures of centrally located vehicle components. In some embodiments, the vehicle is automatically started when the temperature indicated by the fuel temperature sensor falls below a startup temperature threshold value, and is automatically stopped after a predetermined time period or after the temperature reaches a shutdown temperature threshold value.

Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.

Abstract: In some embodiments, a fuel temperature sensor is located proximate to a vehicle component that is expected to experience fuel gelling, such as near or within a fuel filter, in order to obtain temperature information that accurately reflects the likelihood of fuel gelling occurring within the component. The proximate fuel temperature sensor can provide more accurate temperature information for components such as fuel filters that are installed at the periphery of the vehicle, compared to other temperature sensors that measure oil temperatures or other temperatures of centrally located vehicle components. In some embodiments, the vehicle is automatically started when the temperature indicated by the fuel temperature sensor falls below a startup temperature threshold value, and is automatically stopped after a predetermined time period or after the temperature reaches a shutdown temperature threshold value.

Abstract: The present invention provides a thick-film paste composition for printing the front side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal and an oxide composition dispersed in an organic medium that includes microgel particles and an organopolysiloxane.

Abstract: A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

Abstract: In some embodiments, a fuel temperature sensor is located proximate to a vehicle component that is expected to experience fuel gelling, such as near or within a fuel filter, in order to obtain temperature information that accurately reflects the likelihood of fuel gelling occurring within the component. The proximate fuel temperature sensor can provide more accurate temperature information for components such as fuel filters that are installed at the periphery of the vehicle, compared to other temperature sensors that measure oil temperatures or other temperatures of centrally located vehicle components. In some embodiments, the vehicle is automatically started when the temperature indicated by the fuel temperature sensor falls below a startup temperature threshold value, and is automatically stopped after a predetermined time period or after the temperature reaches a shutdown temperature threshold value.

Abstract: This invention provides a polymer thick film electrically conductive paste composition, comprising conductive metal powder, a resin blend of polyol and phenoxy resin, blocked aliphatic polyisocyanate and one or more polar, aprotic solvents. In one embodiment the paste composition is used to form electrically conductive adhesive. In another embodiment the paste composition is used to form an electrically conductive polymer thick film.

Abstract: A conductive paste composition comprises (i) an inorganic powder comprising at least a conductive powder, (ii) at least one microgel polymer, and (iii) a solvent. The paste composition may be used in a process for manufacturing an electrical device comprising: preparing a substrate; applying the conductive paste onto the substrate in a preselected pattern; and heating the applied conductive paste to form a conductive structure that provides an electrode for connecting the device. The paste composition beneficially permits the formation of narrow, high aspect ratio features in the conductive structure.

Abstract: Fraction collector dispensers and methods of using such dispensers are provided. In one embodiment, the dispenser includes an inlet for receiving liquid from a liquid source, wherein the inlet is in fluid communication with an outlet from which liquid is dispensed into a receptacle; and a reservoir in fluid communication with a flow path between the inlet and outlet, wherein the reservoir is configured to receive liquid during movement of the dispenser between receptacles or during movement of receptacles between dispense positions and to receive pressurized air or gas to empty liquid out of the reservoir before or after movement of the dispenser or receptacles, wherein the dispenser is moveable between a first receptacle and a second receptacle or the receptacles are moveable between dispense positions.

Abstract: Certain biphenyic compounds are serotonin modulators useful in the treatment of serotonin-mediated diseases.

Abstract: The present invention provides a thick-film paste composition for printing the front side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal and an oxide composition dispersed in an organic medium that includes microgel particles and an organopolysiloxane.

Abstract: In a first aspect, a composition of matter includes a substantially symmetrical 3-arm star block copolymer having a central core and diblock copolymer arms having inner blocks and outer blocks. In a second aspect, an article includes a substrate, a block copolymer composition on the substrate, and a neutral layer between the substrate and the block copolymer composition.