Patents by Inventor Viachslav BABAYAN
Viachslav BABAYAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11899366Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.Type: GrantFiled: September 7, 2021Date of Patent: February 13, 2024Assignee: Applied Materials, Inc.Inventors: Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani, Daniel J. Woodruff, Randy Harris, Robert B. Moore
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Patent number: 11550224Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. Electrodes may be disposed adjacent the process volume and process fluid is provided to the process volume via a plurality of fluid conduits to facilitate immersion field guided post exposure bake processes. A post process chamber for rinsing, developing, and drying a substrate is also provided.Type: GrantFiled: August 24, 2020Date of Patent: January 10, 2023Assignee: Applied Materials, Inc.Inventors: Kyle M. Hanson, Gregory J. Wilson, Viachslav Babayan
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Patent number: 11262662Abstract: Implementations described herein relate to a platform apparatus for post exposure processing. In one implementation, a platform apparatus includes a plumbing module and a process module. The process module further includes a central region having a robot disposed therein, and a plurality of process stations disposed about the central region and sharing the plumbing module. Each process station includes a process chamber and a post process chamber in a stacked arrangement. The process chamber includes a chamber body defining a process volume, a door coupled to the chamber body, a first electrode coupled to the door, and a power source communicatively coupled to the first electrode.Type: GrantFiled: October 2, 2020Date of Patent: March 1, 2022Assignee: Applied Materials, Inc.Inventors: Viachslav Babayan, Ludovic Godet, Kyle M. Hanson, Robert B. Moore
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Publication number: 20220004104Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.Type: ApplicationFiled: September 7, 2021Publication date: January 6, 2022Inventors: Viachslav BABAYAN, Douglas A. BUCHBERGER, JR., Qiwei LIANG, Ludovic GODET, Srinivas D. NEMANI, Daniel J. WOODRUFF, Randy HARRIS, Robert B. MOORE
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Patent number: 11112697Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.Type: GrantFiled: February 11, 2019Date of Patent: September 7, 2021Assignee: Applied Materials, Inc.Inventors: Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani, Daniel J. Woodruff, Randy Harris, Robert B. Moore
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Patent number: 11094573Abstract: Disclosed herein is an electrostatic chuck (ESC) carrier. The ESC carrier may comprise a carrier substrate having a first surface and a second surface opposite the first surface. A first through substrate opening and a second through substrate opening may pass through the carrier substrate from the first surface to the second surface. A first conductor is in the first through substrate opening, and a second conductor is in the second through substrate opening. The ESC carrier may further comprise a first electrode over the first surface of the carrier substrate and electrically coupled to the first conductor, and a second electrode over the first surface of the carrier substrate and electrically coupled to the second conductor. An oxide layer may be formed over the first electrode and the second electrode.Type: GrantFiled: November 21, 2018Date of Patent: August 17, 2021Assignee: Applied Materials, Inc.Inventors: Jingyu Qiao, Qiwei Liang, Viachslav Babayan, Seshadri Ramaswami, Srinivas D. Nemani
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Patent number: 11049701Abstract: Apparatus and methods for reducing and eliminating accumulation of excessive charged particles from substrate processing systems are provided herein. In some embodiments a process kit for a substrate process chamber includes: a cover ring having a body and a lip extending radially inward from the body, wherein the body has a bottom, a first wall, and a second wall, and wherein a first channel is formed between the second wall and the lip; a grounded shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first channel of the cover ring; and a bias power receiver coupled to the body and extending through an opening in the grounded shield.Type: GrantFiled: November 27, 2017Date of Patent: June 29, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Adolph Miller Allen, William Johanson, Viachslav Babayan, Zhong Qiang Hua, Carl R. Johnson, Vanessa Faune, Jingjing Liu, Vaibhav Soni, Kirankumar Savandaiah, Sundarapandian Ramalinga Vijayalaks Reddy
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Patent number: 10954594Abstract: The present disclosure generally relate to a semiconductor processing apparatus. In one embodiment, a processing chamber is disclosed herein. The processing chamber includes a chamber body and lid defining an interior volume, the lid configured to support a housing having a cap, a substrate support disposed in the interior volume, a vaporizer coupled to the cap and having an outlet open to the interior volume of the processing chamber, wherein the vaporizer is configured to deliver a precursor gas to a processing region defined between the vaporizer and the substrate support, and a heater disposed adjacent to the vaporizer, wherein the heater is configured to heat the vaporizer.Type: GrantFiled: December 2, 2015Date of Patent: March 23, 2021Assignee: Applied Materials, Inc.Inventors: Viachslav Babayan, Qiwei Liang, Tobin Kaufman-Osborn, Ludovic Godet, Srinivas D. Nemani
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Publication number: 20210026257Abstract: Implementations described herein relate to apparatus for post exposure processing. More specifically, implementations described herein relate to field-guided post exposure process chambers and cool down/development chambers used on process platforms. In one implementation, a plurality of post exposure process chamber and cool/down development chamber pairs are positioned on a process platform in a stacked arrangement and utilize a shared plumbing module. In another implementation, a plurality of post exposure process chamber and cool down/development chambers are positioned on a process platform in a linear arrangement and each of the chambers utilize an individually dedicated plumbing module.Type: ApplicationFiled: October 2, 2020Publication date: January 28, 2021Inventors: Viachslav BABAYAN, Ludovic GODET, Kyle M. HANSON, Robert B. MOORE
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Publication number: 20200387074Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. Electrodes may be disposed adjacent the process volume and process fluid is provided to the process volume via a plurality of fluid conduits to facilitate immersion field guided post exposure bake processes. A post process chamber for rinsing, developing, and drying a substrate is also provided.Type: ApplicationFiled: August 24, 2020Publication date: December 10, 2020Inventors: Kyle M. HANSON, Gregory J. WILSON, Viachslav BABAYAN
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Patent number: 10858727Abstract: A deposited amorphous carbon film includes at least 95% carbon. A percentage of sp3 carbon-carbon bonds present in the amorphous carbon film exceeds 30%, and a hydrogen content of the amorphous carbon film is less than 5%. A process of depositing amorphous carbon on a workpiece includes positioning the workpiece within a process chamber and positioning a magnetron assembly adjacent to the process chamber. The magnetron assembly projects a magnetic field into the process chamber. The method further includes providing a carbon target such that the magnetic field extends through the carbon target toward the workpiece. The method further includes providing a source gas to the process chamber, and providing pulses of DC power to a plasma formed from the source gas within the process chamber. The pulses of DC power are supplied in pulses of 40 microseconds or less, that repeat at a frequency of at least 4 kHz.Type: GrantFiled: May 19, 2017Date of Patent: December 8, 2020Assignee: Applied Materials, Inc.Inventors: Jingjing Liu, Zhong Qiang Hua, Adolph Miller Allen, Michael W. Stowell, Srinivas D. Nemani, Chentsau Ying, Bhargav Citla, Viachslav Babayan, Andrej Halabica
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Patent number: 10845715Abstract: Implementations described herein relate to apparatus for post exposure processing. More specifically, implementations described herein relate to field-guided post exposure process chambers and cool down/development chambers used on process platforms. In one implementation, a plurality of post exposure process chamber and cool/down development chamber pairs are positioned on a process platform in a stacked arrangement and utilize a shared plumbing module. In another implementation, a plurality of post exposure process chamber and cool down/development chambers are positioned on a process platform in a linear arrangement and each of the chambers utilize an individually dedicated plumbing module.Type: GrantFiled: August 22, 2019Date of Patent: November 24, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Viachslav Babayan, Ludovic Godet, Kyle M. Hanson, Robert B. Moore
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Patent number: 10754252Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. In one embodiment, a major axis of the processing volume is oriented vertically and a minor axis of the processing volume is oriented horizontally. One or more electrodes may be disposed adjacent the processing volume and at least partially define the processing volume. Process fluid is provided to the processing volume via a plurality of fluid conduits to facilitate immersion field guided post exposure bake processes. A plurality of seals maintains the fluid containment integrity of the processing volume during processing. A post process chamber for rinsing, developing, and drying a substrate is also provided.Type: GrantFiled: December 15, 2017Date of Patent: August 25, 2020Assignee: Applied Materials, Inc.Inventors: Kyle M. Hanson, Gregory J. Wilson, Viachslav Babayan
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Publication number: 20200161156Abstract: Embodiments disclosed herein may include an electrostatic chuck (ESC) carrier. In an embodiment, the ESC carrier may comprise a carrier substrate having a first surface and a second surface opposite the first surface. In an embodiment, a first through substrate opening and a second through substrate opening may pass through the carrier substrate from the first surface to the second surface. Embodiments may include a first conductor in the first through substrate opening, and a second conductor in the second through substrate opening. In an embodiment, the ESC carrier may further comprise a first electrode over the first surface of the carrier substrate and electrically coupled to the first conductor, and a second electrode over the first surface of the carrier substrate and electrically coupled to the second conductor. In an embodiment, an oxide layer may be formed over the first electrode and the second electrode.Type: ApplicationFiled: November 21, 2018Publication date: May 21, 2020Inventors: Jingyu QIAO, Qiwei LIANG, Viachslav BABAYAN, Seshadri RAMASWAMI, Srinivas D. NEMANI
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Patent number: 10615058Abstract: A process chamber having moveable electrodes for generating a parallel field within a process volume filled with a fluid is provided. In one implementation, a major axis of the process chamber is oriented vertically and a substrate support is disposed opposite a plurality of moveable electrodes extending along the major axis of the process chamber. In certain implementations, the substrate support is electrically floating and capable of rotating about a minor axis of the process chamber during processing of a substrate.Type: GrantFiled: March 2, 2017Date of Patent: April 7, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Ludovic Godet, Christine Y. Ouyang, Viachslav Babayan
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Patent number: 10566177Abstract: Embodiments presented herein relate to a pulse control system for a substrate processing system. The pulse control system includes a power source, a system controller, and a pulse shape controller. The pulse shape controller is coupled to the power source and in communication with the system controller. The pulse shape controller includes a first switch assembly and a second switch assembly. The first switch assembly includes a first switch having a first end and a second end. The first switch is configurable between an open state and a closed state. The second switch assembly includes a second switch having a first end and a second end. The first switch is in the closed state and the second switch is in the open state. The first switch in the closed state is configured to allow a pulse supplied by the power source to transfer through the pulse shape controller.Type: GrantFiled: November 11, 2016Date of Patent: February 18, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Michael Stowell, Viachslav Babayan, Jingjing Liu, Zhong Qiang Hua
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Publication number: 20200048760Abstract: Methods of forming a film layer using a HiPIMS PVD process include providing a bias to a substrate in a processing region of a process chamber, the substrate comprising a surface feature and the processing region of the process chamber comprising a sputter target, delivering at least one energy pulse to the sputter target to create a sputtering plasma of a sputter gas in the processing region, the at least one energy pulse having an average voltage between about 600 volts and about 1500 volts and an average current between about 50 amps and about 1000 amps at a frequency which is less than 5 kHz and greater than 100 Hz, and directing the sputtering plasma toward the sputter target to form an ionized species comprising material sputtered from the sputter target, the ionized species forming a film in the feature of the substrate having improved bottom coverage.Type: ApplicationFiled: August 7, 2019Publication date: February 13, 2020Inventors: KISHOR KALATHIPARAMBIL, ADOLPH M ALLEN, JIANXIN LEI, JOTHILINGAM RAMALINGAM, VIACHSLAV BABAYAN
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Publication number: 20190377272Abstract: Implementations described herein relate to apparatus for post exposure processing. More specifically, implementations described herein relate to field-guided post exposure process chambers and cool down/development chambers used on process platforms. In one implementation, a plurality of post exposure process chamber and cool/down development chamber pairs are positioned on a process platform in a stacked arrangement and utilize a shared plumbing module. In another implementation, a plurality of post exposure process chamber and cool down/development chambers are positioned on a process platform in a linear arrangement and each of the chambers utilize an individually dedicated plumbing module.Type: ApplicationFiled: August 22, 2019Publication date: December 12, 2019Inventors: Viachslav BABAYAN, Ludovic GODET, Kyle M. HANSON, Robert B. MOORE
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Patent number: 10474033Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.Type: GrantFiled: August 31, 2017Date of Patent: November 12, 2019Assignee: Applied Materials, Inc.Inventors: Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani, Daniel J. Woodruff, Randy Harris, Robert B. Moore
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Patent number: 10401742Abstract: Implementations described herein relate to apparatus for post exposure processing. More specifically, implementations described herein relate to field-guided post exposure process chambers and cool down/development chambers used on process platforms. In one implementation, a plurality of post exposure process chamber and cool/down development chamber pairs are positioned on a process platform in a stacked arrangement and utilize a shared plumbing module. In another implementation, a plurality of post exposure process chamber and cool down/development chambers are positioned on a process platform in a linear arrangement and each of the chambers utilize an individually dedicated plumbing module.Type: GrantFiled: April 6, 2018Date of Patent: September 3, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Viachslav Babayan, Ludovic Godet, Kyle M. Hanson, Robert B. Moore