Patents by Inventor Vic Chia
Vic Chia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11404350Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.Type: GrantFiled: June 26, 2020Date of Patent: August 2, 2022Assignee: CISCO TECHNOLOGY, INC.Inventors: Vic Chia, Hong Huynh, Steven A. Hanssen, Robert Gregory Twiss
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Patent number: 10903140Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.Type: GrantFiled: April 15, 2019Date of Patent: January 26, 2021Assignee: CISCO TECHNOLOGY, INC.Inventors: Phil Slight, Vic Chia
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Publication number: 20200328136Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.Type: ApplicationFiled: June 26, 2020Publication date: October 15, 2020Inventors: Vic Chia, Hong Huynh, Steven A. Hanssen, Robert Gregory Twiss
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Patent number: 10734306Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.Type: GrantFiled: September 21, 2018Date of Patent: August 4, 2020Assignee: Cisco Technology, Inc.Inventors: Vic Chia, Hong Huynh, Steven A. Hanssen, Robert Gregory Twiss
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Publication number: 20190244877Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.Type: ApplicationFiled: April 15, 2019Publication date: August 8, 2019Inventors: Phil Slight, Vic Chia
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Patent number: 10262919Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.Type: GrantFiled: February 1, 2017Date of Patent: April 16, 2019Assignee: CISCO TECHNOLOGY, INC.Inventors: Phil Slight, Vic Chia
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Publication number: 20190027422Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.Type: ApplicationFiled: September 21, 2018Publication date: January 24, 2019Inventors: Vic Chia, Hong Huynh, Steven A. Hanssen, Robert Gregory Twiss
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Patent number: 10153261Abstract: The subject disclosure relates to an integrated circuit package having an application specific integrated circuit, a high bandwidth memory, a first heat sink having a first footprint and a first path, and a second heat sink having a second footprint and a second path, wherein the second footprint does not exceed the first footprint. The thermal energy through the first path travels from the application specific integrated circuit to the first heat sink and thermal energy through the second path travel from the high bandwidth memory through one or more heat pipes to the second heat sink.Type: GrantFiled: April 3, 2017Date of Patent: December 11, 2018Assignee: CISCO TECHNOLOGY, INC.Inventors: Baris Dogruoz, Vic Chia, M. Onder Cap
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Patent number: 10109558Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.Type: GrantFiled: June 16, 2015Date of Patent: October 23, 2018Assignee: Cisco Technology, Inc.Inventors: Vic Chia, Hong Huynh, Steven A. Hanssen, Robert Gregory Twiss
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Publication number: 20180286844Abstract: The subject disclosure relates to an integrated circuit package having an application specific integrated circuit, a high bandwidth memory, a first heat sink having a first footprint and a first path, and a second heat sink having a second footprint and a second path, wherein the second footprint does not exceed the first footprint. The thermal energy through the first path travels from the application specific integrated circuit to the first heat sink and thermal energy through the second path travel from the high bandwidth memory through one or more heat pipes to the second heat sink.Type: ApplicationFiled: April 3, 2017Publication date: October 4, 2018Inventors: Baris Dogruoz, Vic Chia, M. Onder Cap
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Publication number: 20180220521Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.Type: ApplicationFiled: February 1, 2017Publication date: August 2, 2018Inventors: Phil Slight, Vic Chia
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Patent number: 9949408Abstract: In one embodiment, an electromagnetic interference (EMI) shielding faceplate is configured to mount to a line-card slot of a multi-line-card electronic enclosure having an airflow cooling system. A perforation pattern in the faceplate defines an array of perforations in the faceplate, while a flow control sheet affixed to the faceplate and covering an adjustable percentage of the array of perforations in the faceplate from 0-100%, where an amount of airflow impedance caused by the perforations for the airflow cooling system is based on the percentage of the array of perforations covered by the flow control sheet.Type: GrantFiled: May 27, 2016Date of Patent: April 17, 2018Assignee: Cisco Technology, Inc.Inventors: Vic Chia, M. Baris Dogruoz
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Patent number: 9927852Abstract: In one embodiment, a slot-filler blanking tray includes a vented blanking panel including a vented front panel, the vented blanking panel for fitting over an entrance to one slot of a computer equipment rack including support rails, and a panel arrangement including partition panels to form a slot partition for reversibly inserting into the one slot, supported by the support rails, the slot partition being formed either by unfolding the partition panels or fitting the partition panels together, wherein (a) the vented blanking panel and at least one partition panel of the partition panels are mechanically connected together, or (b) the vented blanking panel includes a first connecting element and the at least one partition panel includes a second connecting element to mechanically connect the vented blanking panel and the at least one partition panel together. Related apparatus and methods are also described.Type: GrantFiled: August 25, 2015Date of Patent: March 27, 2018Assignee: Cisco Technology, Inc.Inventors: Vic Chia, Long Huu Dang, Hong Huynh
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Publication number: 20170347495Abstract: In one embodiment, an electromagnetic interference (EMI) shielding faceplate is configured to mount to a line-card slot of a multi-line-card electronic enclosure having an airflow cooling system. A perforation pattern in the faceplate defines an array of perforations in the faceplate, while a flow control sheet affixed to the faceplate and covering an adjustable percentage of the array of perforations in the faceplate from 0-100%, where an amount of airflow impedance caused by the perforations for the airflow cooling system is based on the percentage of the array of perforations covered by the flow control sheet.Type: ApplicationFiled: May 27, 2016Publication date: November 30, 2017Inventors: Vic Chia, M. Baris Dogruoz
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Publication number: 20170060197Abstract: In one embodiment, a slot-filler blanking tray includes a vented blanking panel including a vented front panel, the vented blanking panel for fitting over an entrance to one slot of a computer equipment rack including support rails, and a panel arrangement including partition panels to form a slot partition for reversibly inserting into the one slot, supported by the support rails, the slot partition being formed either by unfolding the partition panels or fitting the partition panels together, wherein (a) the vented blanking panel and at least one partition panel of the partition panels are mechanically connected together, or (b) the vented blanking panel includes a first connecting element and the at least one partition panel includes a second connecting element to mechanically connect the vented blanking panel and the at least one partition panel together. Related apparatus and methods are also described.Type: ApplicationFiled: August 25, 2015Publication date: March 2, 2017Inventors: Vic CHIA, Long Huu Dang, Hong Huynh
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Publication number: 20160374232Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.Type: ApplicationFiled: June 16, 2015Publication date: December 22, 2016Inventors: Vic Chia, Hong Huynh, Steven A. Hanssen, Robert Gregory Twiss
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Publication number: 20070121281Abstract: In accordance with one embodiment, the present invention relates to a support structure for an electronic component, such as a voltage regulator module for a computer device. The exemplary support structure has a body and a leg extending askew from the body, the leg and body cooperating to define a receiving region for receiving the electronic component. The leg has a resilient securement portion that is configured to releasably engage with an electronics substrate.Type: ApplicationFiled: November 28, 2005Publication date: May 31, 2007Inventors: Vic Chia, Paul Wirtzberger, Michelle Austin
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Publication number: 20070111550Abstract: A cable assembly comprising a hollow sleeve, an electrical conductor within the hollow sleeve, and first and second connectors on opposing ends of the electrical conductor that are fastened to opposing ends of the sleeve. The first connector is adapted to blind-mate to a corresponding connector in a cabinet backplane and the second connector is adapted to couple to an electronic device to be installed in the cabinet. Power is provided from the backplane to the electronic device via the electrical conductor. The hollow sleeve is disposed within a tunnel supported by the cabinet. The hollow sleeve has a length greater than that of the tunnel such that the first connector protrudes from a first opening of the tunnel and the second connector protrudes from a second opening of the tunnel.Type: ApplicationFiled: November 14, 2005Publication date: May 17, 2007Inventors: Vic Chia, Martha Peterson, Robert Skoog, Terrel Morris