Patents by Inventor Vick Dhanapal

Vick Dhanapal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230364845
    Abstract: A sizer for cooling an extrudate, which includes a clad core and a housing. The clad core includes an extrusion channel which accommodates the extrudate, and a core vacuum port in fluid communication with the extrusion channel. The housing includes a cooling channel and a housing vacuum channel. The cooling channel does not exist in the clad core and is adapted to circulate a coolant through the housing.
    Type: Application
    Filed: May 16, 2022
    Publication date: November 16, 2023
    Inventors: Vick Dhanapal, Gary Oney, Roger May, Troy Kimmes
  • Publication number: 20220266497
    Abstract: A sizer for cooling an extrudate, which includes a core and a housing. The core includes an extrusion channel which accommodates the extrudate, a core cooling channel, and a core vacuum channel in fluid communication with the extrusion channel. The housing includes a housing cooling channel and a housing vacuum channel. The core cooling channel is in fluid communication with the housing cooling channel, and the core vacuum channel is in fluid communication with the housing vacuum channel.
    Type: Application
    Filed: May 16, 2022
    Publication date: August 25, 2022
    Inventors: Vick Dhanapal, Gary Oney, Roger May, Troy Kimmes