Patents by Inventor Vicki L. Smith

Vicki L. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7545651
    Abstract: A memory module according to one implementation includes a support substrate, plural memory devices mounted on the support substrate, and pins having a predetermined arrangement on the support substrate, the pins comprising signal pins connected to the memory devices, power pins, and ground pins. In the predetermined arrangement of pins, each signal pin uses a ground pin as a reference, and each power pin is adjacent a ground pin for reduced impedance between the power pin and ground pin. In some implementations, some of the signal pins are associated with redundant pins.
    Type: Grant
    Filed: April 18, 2005
    Date of Patent: June 9, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: June E. Goodwin, Michael C. Day, Brian M. Johnson, John A. Nerl, Richard A. Schumacher, Vicki L. Smith
  • Patent number: 7212424
    Abstract: One memory module includes a printed circuit board comprising an upper row of memory integrated circuits, a lower row of memory integrated circuits, and a first addressing register and a second addressing register, the first addressing register and a second addressing register each having at least one of address and control input routing primarily provided in a first layer, the first addressing register coupled to the upper row of memory integrated circuits and the second addressing register coupled to the lower row of memory integrated circuits.
    Type: Grant
    Filed: March 21, 2005
    Date of Patent: May 1, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brian M. Johnson, John Nerl, Ronald J. Bellomlo, Michael C. Day, Vicki L. Smith, Richard A. Schumacher, Rajakrishnan Radjassamy, June E. Goodwin