Patents by Inventor Vicky K. Yang

Vicky K. Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7829442
    Abstract: Dislocation pile-ups in compositionally graded semiconductor layers are reduced or eliminated, thereby leading to increased semiconductor device yield and manufacturability. This is accomplished by introducing a semiconductor layer having a plurality of threading dislocations distributed substantially uniformly across its surface as a starting layer and/or at least one intermediate layer during growth and relaxation of the compositionally graded layer. The semiconductor layer may include a seed layer disposed proximal to the surface of the semiconductor layer and having the threading dislocations uniformly distributed therein.
    Type: Grant
    Filed: November 16, 2007
    Date of Patent: November 9, 2010
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Richard Westhoff, Vicky K. Yang, Matthew T. Currie, Christopher Vineis, Christopher Leitz
  • Publication number: 20080135830
    Abstract: Semiconductor structures are formed with semiconductor layers having reduced compositional variation. Top surfaces of the semiconductor layers are substantially haze-free.
    Type: Application
    Filed: December 21, 2007
    Publication date: June 12, 2008
    Applicant: AmberWave Systems Corporation
    Inventors: Richard Westhoff, Christopher J. Vineis, Matthew T. Currie, Vicky K. Yang, Christopher W. Leitz
  • Publication number: 20040214407
    Abstract: Semiconductor structures are formed with semiconductor layers having reduced compositional variation. Top surfaces of the semiconductor layers are substantially haze-free.
    Type: Application
    Filed: January 27, 2004
    Publication date: October 28, 2004
    Applicant: AmberWave Systems Corporation
    Inventors: Richard Westhoff, Christopher J. Vineis, Matthew T. Currie, Vicky K. Yang, Christopher W. Leitz