Abstract: For a managed network including multiple host machines implementing multiple logical networks, some embodiments provide a method that reduces the memory and traffic load required to implement the multiple logical networks. The method generates configuration data for each of multiple host machines including (i) data to configure a host machine to implement a set of logical forwarding elements that belong to a set of routing domains and (ii) identifiers for each routing domain in the set of routing domains. The method then receives data regarding tunnels endpoints operating on each of the host machines and an association with the routing identifiers sent to the host machines. The method then generates a routing domain tunnel endpoint list for each routing domain based on the data received from each of the host machines including a list of the tunnel endpoints associated with the routing domain which the host machines can use to facilitate packet processing.

Abstract: For a managed network including multiple host machines implementing multiple logical networks, some embodiments provide a method that reduces the memory and traffic load required to implement the multiple logical networks. The method generates configuration data for each of multiple host machines including (i) data to configure a host machine to implement a set of logical forwarding elements that belong to a set of routing domains and (ii) identifiers for each routing domain in the set of routing domains. The method then receives data regarding tunnels endpoints operating on each of the host machines and an association with the routing identifiers sent to the host machines. The method then generates a routing domain tunnel endpoint list for each routing domain based on the data received from each of the host machines including a list of the tunnel endpoints associated with the routing domain which the host machines can use to facilitate packet processing.

Abstract: For a managed network including multiple host machines implementing multiple logical networks, some embodiments provide a method that reduces the memory and traffic load required to implement the multiple logical networks. The method generates configuration data for each of multiple host machines including (i) data to configure a host machine to implement a set of logical forwarding elements that belong to a set of routing domains and (ii) identifiers for each routing domain in the set of routing domains. The method then receives data regarding tunnels endpoints operating on each of the host machines and an association with the routing identifiers sent to the host machines. The method then generates a routing domain tunnel endpoint list for each routing domain based on the data received from each of the host machines including a list of the tunnel endpoints associated with the routing domain which the host machines can use to facilitate packet processing.

Abstract: For a managed network including multiple host machines implementing multiple logical networks, some embodiments provide a method that reduces the memory and traffic load required to implement the multiple logical networks. The method generates configuration data for each of multiple host machines including (i) data to configure a host machine to implement a set of logical forwarding elements that belong to a set of routing domains and (ii) identifiers for each routing domain in the set of routing domains. The method then receives data regarding tunnels endpoints operating on each of the host machines and an association with the routing identifiers sent to the host machines. The method then generates a routing domain tunnel endpoint list for each routing domain based on the data received from each of the host machines including a list of the tunnel endpoints associated with the routing domain which the host machines can use to facilitate packet processing.

Abstract: For a managed network including multiple host machines implementing multiple logical networks, some embodiments provide a method that reduces the memory and traffic load required to implement the multiple logical networks. The method generates configuration data for each of multiple host machines including (i) data to configure a host machine to implement a set of logical forwarding elements that belong to a set of routing domains and (ii) identifiers for each routing domain in the set of routing domains. The method then receives data regarding tunnels endpoints operating on each of the host machines and an association with the routing identifiers sent to the host machines. The method then generates a routing domain tunnel endpoint list for each routing domain based on the data received from each of the host machines including a list of the tunnel endpoints associated with the routing domain which the host machines can use to facilitate packet processing.

Abstract: For a managed network including multiple host machines implementing multiple logical networks, some embodiments provide a method that reduces the memory and traffic load required to implement the multiple logical networks. The method generates configuration data for each of multiple host machines including (i) data to configure a host machine to implement a set of logical forwarding elements that belong to a set of routing domains and (ii) identifiers for each routing domain in the set of routing domains. The method then receives data regarding tunnels endpoints operating on each of the host machines and an association with the routing identifiers sent to the host machines. The method then generates a routing domain tunnel endpoint list for each routing domain based on the data received from each of the host machines including a list of the tunnel endpoints associated with the routing domain which the host machines can use to facilitate packet processing.

Abstract: In accordance with various embodiments, a set of features are described for enabling an application server platform for telecom based applications. A system for providing an application server for telecom-based applications can include an application server that includes a session initiation protocol (SIP) adapter. The SIP adapter can use a connection oriented protocol and provides interactions with application code in an actor of said application server by means of asynchronized SIP protocol events. The SIP adapter can also provide stateless node mapping to a stateful server node hosting a specific session for the actor.

Abstract: In accordance with various embodiments, a set of features are described for enabling an application server platform for telecom based applications. A system for providing an application server for telecom-based applications can include an application server that includes a session initiation protocol (SIP) adapter. The SIP adapter can use a connection oriented protocol and provides interactions with application code in an actor of said application server by means of asynchronized SIP protocol events. The SIP adapter can also provide stateless node mapping to a stateful server node hosting a specific session for the actor.

Abstract: A semiconductor package with an exposed heat spreader includes a substrate having a semiconductor chip adhered to a first surface of the substrate. The heat spreader includes an upper portion, a lower portion with an opening formed in the center for receiving the semiconductor chip, and a connecting portion for connecting the upper portion and the lower portion in a manner that the upper portion is raised to a height above the opening of the lower portion. The lower portion is formed with a plurality of positioning members outwardly extending from edges of the lower portion to prevent the heat spreader from being dislocated during a molding process, and further includes downward flutes formed on the periphery of the opening for enabling resin flow underneath the heat spreader. The upper portion of the heat spreader is exposed to an exterior of the semiconductor package to improve heat dissipation.

Abstract: A multi-chip IC package for central pad chips is proposed, which can be used to pack one peripheral-pad IC chip and at least one central-pad IC chip therein. The multi-chip IC package includes a specially-designed lead frame having a central die pad and a lead portion separated from the central die pad by a gap. The central-pad IC chip is partly attached to the lead portion of the lead frame and partly attached to the central die pad of the lead frame such that the central pads on the central-pad IC chip can be aligned with the gap of lead frame so as to allow bonding wires electrically connecting the central-pad IC chip with the lead portion of the lead frame to pass therethrough. The characterized package allows the bonding wires applied to the central-pad IC chip to be short in length so as to retain IC performance and save manufacture cost, making this multi-chip IC package structure more advantageous to use than the prior art.

Abstract: An integrated circuit package with a fully-exposed heat sink is provided. The integrated circuit package includes a substrate having a first side being formed with first conductive traces and a second side being formed with second conductive traces. At least one chip is mounted on the substrate and electrically connected to the first conductive traces. A plurality of solder balls are provided at the terminal ends of the second conductive traces to allow external connection of the chip. The fully-exposed heat sink is mounted on the substrate. The heat sink is formed with a plurality of supportive legs arranged in such a manner as to allow a bottom surface of the heat sink to be separated from the chip and a top surface of the heat sink to be tightly attached to a cavity in a mold used to form an encapsulant for enclosing the chip. A plurality of positioning tongues are formed on the heat sink for securing the heat sink in position when performing a molding process for forming the encapsulant.