Patents by Inventor Vicky M. Ochoa

Vicky M. Ochoa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating an interconnect structure with hard mask and low dielectric constant materials
    Patent number: 6027995
    Abstract: An interconnect system is provided. The interconnect system includes a silicon substrate and a first dielectric layer formed upon the silicon substrate. The interconnect system also includes a first level of at least two electrically conductive lines formed upon the first dielectric layer. The interconnect system further includes a region of low dielectric constant material formed between the at least two electrically conductive lines. The interconnect system also includes a first hard mask formed upon the polymer region.
    Type: Grant
    Filed: August 18, 1998
    Date of Patent: February 22, 2000
    Assignee: Intel Corporation
    Inventors: Chien Chiang, Chuanbin Pan, Vicky M. Ochoa, Sychyi Fang, David B. Fraser, Joyce C. Sum, Gary William Ray, Jeremy A. Theil
  • Interconnect structure with hard mask and low dielectric constant materials
    Patent number: 5886410
    Abstract: An interconnect system is provided. The interconnect system includes a silicon substrate and a first dielectric layer formed upon the silicon substrate. The interconnect system also includes a first level of at least two electrically conductive lines formed upon the first dielectric layer. The interconnect system further includes a region of low dielectric constant material formed between the at least two electrically conductive lines. The interconnect system also includes a first hard mask formed upon the polymer region.
    Type: Grant
    Filed: June 26, 1996
    Date of Patent: March 23, 1999
    Assignee: Intel Corporation
    Inventors: Chien Chiang, Chuanbin Pan, Vicky M. Ochoa, Sychyi Fang, David B. Fraser, Joyce C. Sum, Gary William Ray, Jeremy A. Theil