Abstract: An apparatus (1b) and method of depleting a plasma of electrons in a plasma coating apparatus is disclosed. The invention involves generating a plasma comprising ions (9), particulate material (5) and electrons (6) adjacent a target (4); forming a plasma trap (52) to constrain the plasma near to the target (4), and depleting the plasma of electrons by: providing an additional magnetic field (8b) that is superimposed over the magnetic field of the plasma trap (3, 52), which extends beyond a boundary layer (52) of the plasma trap, and which draws electrons (6) from, or near to, the boundary layer (52) of the plasma trap away from the target (4). The invention proposes applying a baseline voltage (50) to the target (4); and by applying periodic voltage pulses (13b) to the target (4). The additional magnetic field (8b) depletes the plasma of electrons, such that when a voltage pulse (13b) is applied to the target (4), ions (9) can be ejected from the plasma with reduced electron shielding.

Abstract: A medical implant comprising: ?an implant body configured for use as a medical implant, ?a surface on the implant body, ?wherein the surface comprises a plurality of projections (40), each projection having a base proximal to the implant body, a peak distal to the implant body, and a side wall extending from the base to the peak, ?wherein the surface has a peak density in a range 50 to 500 peaks per 11 m2, and ?wherein the projections are tapered such that a width at the peak of each projection is less than a width at the base of each projection.

Abstract: A bio control surface (100) comprising a substrate (5) and a first plurality of discrete, spaced-apart particles (1) disposed on the substrate (5) and a second plurality of discrete, spaced-apart particles (6) disposed on the substrate (5), wherein the first (1) and second (6) pluralities of discrete, spaced-apart particles are formed from species having different chemical and/or electrical properties. An intermediate layer (4) may be interposed between the particles (1, 6) and the substrate (5). The bio control surface (100) can be activated by exposure to particular conditions, which cause the first (1) and second (6) pluralities of particles to adopt different potentials (+, ?), such that flow of charge, heat, ions etc. can be used to neutralise or kill bacteria or microorganisms resident on the surface (100).

Abstract: This invention relates to generation and control of electron emission and transport in a plasma device for enhancing ionization in sputtering, including magnetron sputtering, ion treatment, thermal evaporation, electron beam evaporation. The device in combines a sputtering enhanced electron emission on a cathodic element in which a strong electrical field around the electron emission element is created. In addition, this electric field area is in a magnetically confined space of nearly null strength and/or magnetic mirror features. The electron emission area would also comprise of guided magnetic field extraction magnetic field paths which could be either permanent or created at pulse modes. Also, the invention relates to reactive process and coating deposition ion bombardment management. This invention also relates to the use in feedback control systems; manufacturing process and methods which use these devices and materials and components processed by the present invention are also part of the invention.

Abstract: A method is provided for automated tuning and calibration of feedback control of systems and processes. A series of actuator pulses are automatically performed and, based on the gradient of the sensor response, information is determined on the dynamics of the system to be controlled in what is described as the system identification procedure. An automatic sensor calibration procedure is performed to determine the controller's window of operation. Based on the information collected during the system identification procedure, controller parameters are automatically calculated for a specified time for the sensor to reach a setpoint. A system that is managed and/or controlled by a controller and/or control algorithm is also provided. The disclosed method provides a scheme for parameterization of control algorithms.

Abstract: An ion source comprising: an electrode; a counter electrode; means for generating an electrical potential between the electrode and counter-electrode; one or more magnets arranged, in use, to confine a plasma generated around the electrode upon application of the said electrical potential; and an aperture in the counter-electrode through which ions from the said plasma can escape; characterized in that: the means for generating an electrical potential between the electrode and counter electrode comprises a DC signal generator that is: electrically connected to the electrode and the counter-electrode; adapted, in use, to apply a baseline DC potential to the electrode and the counter-electrode with the DC potential at the electrode being positive relative to the DC potential at the counter electrode; and adapted, in use, to apply a sequence of DC pulses superimposed onto the baseline DC potential.

Abstract: This invention relates to the automated tuning and calibration of feedback control of systems and processes. According to the present invention a series of actuator pulses are automatically performed and, based on the gradient of the sensor response, information is determined on the dynamics of the system to be controlled (this will be known as the system identification procedure). This is preceded by an automatic sensor calibration procedure in order to determine the controller's window of operation. Based on the information collected during the system identification procedure controller parameters are automatically calculated for a specified time for the sensor to reach the setpoint. The present invention relates to any system that is managed and/or controlled by a controller and/or control algorithm. The present invention relates to the use of the present method for parameterisation of any control algorithm, for example, PID, PI, P, PDF.

Abstract: A bio control surface (100) comprising a substrate (5) and a first plurality of discrete, spaced-apart particles (1) disposed on the substrate (5) and a second plurality of discrete, spaced-apart particles (6) disposed on the substrate (5), wherein the first (1) and second (6) pluralities of discrete, spaced-apart particles are formed from species having different chemical and/or electrical properties. An intermediate layer (4) may be interposed between the particles (1, 6) and the substrate (5). The bio control surface (100) can be activated by exposure to particular conditions, which cause the first (1) and second (6) pluralities of particles to adopt different potentials (+, ?), such that flow of charge, heat, ions etc. can be used to neutralise or kill bacteria or microorganisms resident on the surface (100).

Abstract: This invention relates to magnetically enhanced cathodic plasma deposition and cathodic plasma discharges where the charged particles can be guided in a rarefied vacuum system. Specifically, a cluster or combination of cathodic plasma sources is described where a least two plasma source units are arranged in a rarefied gas vacuum system in such way that the resulting magnetic field interaction offers a guided channelling escape path of electrons in essentially perpendicular direction to the main bulk of neutral particles and droplets generated in the cathodic plasma source. In addition the cathodic plasma source arrangement of the present invention would generate a zone of very low magnetic field where the electrons are trapped via electric and magnetic fields. Ions generated by the plasma cluster would follow electrons via escape paths determined by electric and magnetic fields.

Abstract: A magnetron sputtering apparatus (100) comprising: a magnetic array arranged to create a magnetic field (103) in the vicinity of a tubular target (2) which target at least partially surrounds the magnetic array and acts as a cathode (2a); an anode (2b); the magnetic array being arranged to create an asymmetric plasma distribution with respect to the normal angle of incidence to a substrate (3); and means (1b) for enhancing the magnetic field to produce a relatively low impedance path for electrons flowing from the cathode (2a) to the anode (2b).

Abstract: Coating barrier layer and manufacturing process, for coating a base substrate, comprising said barrier layer a group of, at least, an inorganic layer and a polymeric layer, where a metal rich interface layer is disposed between the inorganic layer and the polymeric layer.

Abstract: Ionisation device, comprising a linear hollow cathode device which has hollow cathode electrodes, defining a main hollow cathode electrode gap in which a magnetic field created by means of magnetic elements is confined; and a gas distribution element in which a gas distribution cavity is arranged providing uniform gas distribution on the main hollow cathode electrode gap with suitable powering which in a substantially vacuum environment would be able to produce a substantially linear plasma discharge which is spatially extended by the relative position of the hollow cathode electrodes and an anode element wherein this extended plasma allowing a wide interaction with particles travelling from a coating material source ionised in order to produce a coating or a plasma treatment on a substrate surface.

Abstract: A magnetron sputtering apparatus (100) comprising: a magnetic array arranged to create a magnetic field (103) in the vicinity of a tubular target (2) which target at least partially surrounds the magnetic array and acts as a cathode (2a); an anode (2b); the magnetic array being arranged to create an asymmetric plasma distribution with respect to the normal angle of incidence to a substrate (3); and means (1b) for enhancing the magnetic field to produce a relatively low impedance path for electrons flowing from the cathode (2a) to the anode (2b).

Abstract: A target arrangement for use within a vacuum sputtering zone comprising: a primary target (1) comprising material to be sputtered and an auxiliary target (2) of ferromagnetic material, the targets being located relative to one another such that upon application of a magnetic field across the surface of the targets, the magnetic field over the primary target is confined into an area of high homogeneous magnetic field strength substantially parallel to the surface of the primary target, to achieve uniform erosion across said area of target during sputtering. Preferably the primary target and auxiliary target are spaced apart by a gap (12), to enhance the confinement of magnetic field. The auxiliary target may have a surface which is raised beyond a surface of the primary target. The primary target may be of ferromagnetic or non-magnetic material.

Abstract: Disclosed is a metal sulphide coating composition of the formula MXSiVRYSZFW where M is one or more metals selected from: Mo, Ti, W, Nb, Ta, Zr, and Hf; Si is silicon; R is one or more elements selected from: C, B, Al, V, Cr, Fe, Co, Ni, Sm, Au, Cu, Zn, Sn, Pb, N, H, and O; S is sulphur; F is fluorine; X is 0.2 to 1.5; V is 0.02 to 3; Y is 0 to 4; Z is 0.2 to 6; and W is 0.01 to 6, and in which X, Y, Z, V, and W are given in amounts by atomic ratio. The compositions show good non-stick properties, low hydrophilia, and high stability.

Abstract: An unbalanced magnetron sputter ion plating system has a first magnetron with a first target of metal sulphide (e.g. MoS2) and a second magnetron with a second target of metal (e.g. Titanium). In order to recover water and sulphur impurities from the surfaces of the coating chamber the metal target is energised in a pre-coating ion cleaning operation. The Titanium target remains energised during the deposition of the molybdenum-sulphur coating to produce a MoxTiySz coating where x+y≈1 and Z≈2. Best results are achieved if the Titanium content is about 18% or less by weight of the total coating content.