Patents by Inventor Victor C. M. Wong

Victor C. M. Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leaded semiconductor power module with direct bonding and double sided cooling
    Patent number: 7759778
    Abstract: A leaded semiconductor power module includes a first heatsink, an electrically insulated substrate thermally coupled to the first heatsink, one or more semiconductor chips, a leadframe substrate, and a second heatsink thermally coupled to the leadframe substrate, the assembly being overmolded with an encapsulant to expose the first heatsink, the second heatsink and peripheral terminals of the leadframe substrate. The semiconductor chips are electrically and structurally coupled to both the insulated substrate and the leadframe substrate, and conductive spacers electrically and structurally couple the insulated substrate to the leadframe substrate.
    Type: Grant
    Filed: September 15, 2008
    Date of Patent: July 20, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Michael J. Lowry, Eric A. Brauer, Thomas A. Degenkolb, Victor C. M. Wong
  • Leaded semiconductor power module with direct bonding and double sided cooling
    Publication number: 20100065950
    Abstract: A leaded semiconductor power module includes a first heatsink, an electrically insulated substrate thermally coupled to the first heatsink, one or more semiconductor chips, a leadframe substrate, and a second heatsink thermally coupled to the leadframe substrate, the assembly being overmolded with an encapsulant to expose the first heatsink, the second heatsink and peripheral terminals of the leadframe substrate. The semiconductor chips are electrically and structurally coupled to both the insulated substrate and the leadframe substrate, and conductive spacers electrically and structurally couple the insulated substrate to the leadframe substrate.
    Type: Application
    Filed: September 15, 2008
    Publication date: March 18, 2010
    Inventors: Michael J. Lowry, Eric A. Brauer, Thomas A. Degenkolb, Victor C.M. Wong