Patents by Inventor Victor Cher Khng Tan
Victor Cher Khng Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8373277Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.Type: GrantFiled: January 28, 2008Date of Patent: February 12, 2013Assignee: Micron Technology, Inc.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Patent number: 7799610Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies are provided.Type: GrantFiled: October 15, 2007Date of Patent: September 21, 2010Assignee: Micron Technology, Inc.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Patent number: 7575953Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.Type: GrantFiled: December 18, 2007Date of Patent: August 18, 2009Assignee: Micron Technology, Inc.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Publication number: 20080136045Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.Type: ApplicationFiled: January 28, 2008Publication date: June 12, 2008Applicant: MICRON TECHNOLOGY, INC.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Patent number: 7371608Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.Type: GrantFiled: March 14, 2003Date of Patent: May 13, 2008Assignee: Micron Technology, Inc.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Patent number: 7358117Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.Type: GrantFiled: August 29, 2006Date of Patent: April 15, 2008Assignee: Micron Technology, Inc.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Patent number: 7344969Abstract: Semiconductor devices and stacked die assemblies, and methods of fabrication are provided. In various embodiments, the die assembly comprises a first die mounted on a substrate and a second die mounted on the first die. In one embodiment, the second die has a recessed edge along the perimeter of the bottom surface to provide clearance for a bonding element extending from bond pads on the first die to pads on the substrate, thus eliminating the need for a spacer between the two dies. In another embodiment, the second die is at least partially disposed within a recess in the upper surface of the first die. In another embodiment, an adhesive element is disposed within a recess in the bottom surface of the first die for attaching the first die to the substrate. In yet another embodiment, the first die is at least partially disposed within a recess within the bottom surface of the second die. The stacked die assemblies can be encapsulated to form semiconductor packages.Type: GrantFiled: April 28, 2003Date of Patent: March 18, 2008Assignee: Micron Technology, Inc.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Patent number: 7332819Abstract: Semiconductor devices and stacked die assemblies, are provided which have at least two semiconductor dies disposed on a substrate in a stacked arrangement, the first and second dies having first surfaces having bond pads, the second die having a second surface with a recessed edge portion along a perimeter of that die, and the recessed edge portion having a height sufficient for clearance of bonding elements extending from the first die.Type: GrantFiled: February 5, 2002Date of Patent: February 19, 2008Assignee: Micron Technology, Inc.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Patent number: 7332820Abstract: Semiconductor devices and stacked die assemblies, and methods of fabrication are provided. In various embodiments, the die assembly comprises a first die mounted on a substrate and a second die mounted on the first die. In one embodiment, the second die has a recessed edge along the perimeter of the bottom surface to provide clearance for a bonding element extending from bond pads on the first die to pads on the substrate, thus eliminating the need for a spacer between the two dies. In another embodiment, the second die is at least partially disposed within a recess in the upper surface of the first die. In another embodiment, an adhesive element is disposed within a recess in the bottom surface of the first die for attaching the first die to the substrate. In yet another embodiment, the first die is at least partially disposed within a recess within the bottom surface of the second die. The stacked die assemblies can be encapsulated to form semiconductor packages.Type: GrantFiled: April 28, 2003Date of Patent: February 19, 2008Assignee: Micron Technology, Inc.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Patent number: 7309623Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.Type: GrantFiled: August 29, 2006Date of Patent: December 18, 2007Assignee: Micron Technology, Inc.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Patent number: 7282392Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.Type: GrantFiled: August 29, 2006Date of Patent: October 16, 2007Assignee: Micron Technology, Inc.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Patent number: 7282390Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies are provided. In an embodiment of the methods, a second die is mounted on a first die which is at least partially received within a recess of the second die and an overall height of the dies within the device is less than a combined height of the dies.Type: GrantFiled: May 25, 2006Date of Patent: October 16, 2007Assignee: Micron Technology, Inc.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Patent number: 7112048Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.Type: GrantFiled: April 8, 2003Date of Patent: September 26, 2006Assignee: Micron Technology, Inc.Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
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Patent number: 6720666Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.Type: GrantFiled: April 8, 2003Date of Patent: April 13, 2004Assignee: Micron Technology, Inc.Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
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Patent number: 6692987Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.Type: GrantFiled: February 5, 2002Date of Patent: February 17, 2004Assignee: Micron Technology, Inc.Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
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Publication number: 20030211660Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.Type: ApplicationFiled: April 8, 2003Publication date: November 13, 2003Applicant: Micron Technology, Inc.Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
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Publication number: 20030211659Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.Type: ApplicationFiled: April 8, 2003Publication date: November 13, 2003Applicant: Micron Technology, Inc.Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
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Publication number: 20030207515Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.Type: ApplicationFiled: April 28, 2003Publication date: November 6, 2003Applicant: Micron Technology, Inc., Boise, IDInventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Publication number: 20030207516Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.Type: ApplicationFiled: April 28, 2003Publication date: November 6, 2003Applicant: Micron Technology, Inc.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour
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Publication number: 20030162325Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.Type: ApplicationFiled: March 14, 2003Publication date: August 28, 2003Applicant: Micron Technology, Inc.Inventors: Hock Chuan Tan, Thiam Chye Lim, Victor Cher Khng Tan, Chee Peng Neo, Michael Kian Shing Tan, Beng Chye Chew, Cheng Poh Pour