Abstract: A method of producing a luminescent viewing screen using a quadrupole focus mask having apertures substantially larger than the phosphor screen elements is described. The method includes the steps of providing a film of a photosensitive polymeric substance on a faceplate and exposing the film through the focus mask. A first phosphor material is subsequently deposited on the region of the faceplate that was shadowed during the exposure. The process is repeated at different angles of exposure and with different color-emitting phosphor materials until at least two and preferably three different color emitting phosphor materials are deposited to form a cyclic array of screen elements.

Abstract: A display device includes an evacuated envelope having a back wall and a plurality of mutually parallel internal support walls. Each of the support walls comprises a separable first and second wall member. Each of the first wall members has a proximal end in contact with the back wall. The support walls are substantially perpendicular to the back wall so that the support walls partition the device into a plurality of channels. A faceplate assembly integral with one surface of the envelope comprises in combination; a viewing faceplate, a mosaic screen, registration blocks disposed on the inner surface of the faceplate beyond the screen, a plurality of second wall members detachably attached to the registration blocks so that each of the second wall members extend between the distal end of a different one of the first wall members and the screen, and a plurality of discrete shadow masks slidably attached to and extending between adjacent ones of the second wall members.

Abstract: A first die having a relief pattern is employed to provide predetermined shape and relative positioning for a first plurality of metal strips. A second die is similarly employed for a second plurality of metal strips Without removing the metal strips from the dies, the strips, still in predetermined shape and position, are bonded to opposing surfaces of an insulating substrate. The bonding process includes bringing the dies, and hence, the metal strips, into contact with the opposing surfaces of the insulating substrate. The bonding process may include the application of heat, pressure, and an electrical field across the bonding interfaces, e.g., anodic bonding.