Patents by Inventor Victor dela cruz Del Rosario

Victor dela cruz Del Rosario has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Package with Blind Hole Attachment to Heat Sink
    Publication number: 20230125452
    Abstract: A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.
    Type: Application
    Filed: October 25, 2021
    Publication date: April 27, 2023
    Inventors: Ryan Tordillo Comadre, Victor Dela Cruz Del Rosario, Bernie Tabanao Rosales, Subaramaniym Senivasan, Heng Chen Tang
  • Radio frequency power device
    Patent number: 9245837
    Abstract: An electronic RF power device includes a transistor chip, a device input terminal and a device output terminal. Further, the electronic RF power device includes an output impedance transformation circuit, an output contact clip bonded to the transistor chip and to the output device terminal and at least one bond wire bonded to the output impedance transformation circuit and to the transistor chip.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: January 26, 2016
    Assignee: Infineon Technologies AG
    Inventors: Eljurey Azcarraga Fajardo, Siti Maznah Abdul Rahim, Victor dela cruz Del Rosario, Xavier Arokiasamy, Vittal Raja Manikam
  • RADIO FREQUENCY POWER DEVICE
    Publication number: 20160005687
    Abstract: An electronic RF power device includes a transistor chip, a device input terminal and a device output terminal. Further, the electronic RF power device includes an output impedance transformation circuit, an output contact clip bonded to the transistor chip and to the output device terminal and at least one bond wire bonded to the output impedance transformation circuit and to the transistor chip.
    Type: Application
    Filed: July 7, 2014
    Publication date: January 7, 2016
    Inventors: Eljurey Azcarraga Fajardo, Siti Maznah Abdul Rahim, Victor dela cruz Del Rosario, Xavier Arokiasamy, Vittal Raja Manikam