Abstract: An endoscope includes a housing with a distal end insertable into a cavity; an image capture device at the distal end to obtain 3D images, and process them to form a video signal; and a folded substrate folded into a U-shape having first and second legs. The image capture device includes a detector and a lens system with right and left multi-band pass filters having right pass bands that are complements of left pass bands. The lens system receives the 3D images including right and left images. The detector faces the lens system to obtain the right and left images. A processing circuit faces the proximal end behind the detector to process signals from the detector. The folded substrate includes the detector at an outer side of the first leg facing the lens system and the processing circuit at an outer side of the second leg facing the proximal end.

Abstract: Bulk metallic glass-based gripping arrays of nano- or micro-scale grippers are described, along with the methods of fabrication and use thereof. BMG-based gripping arrays can be fabricated via facile and scalable thermoplastic forming/molding methods typically available to polymeric materials, yet they possess many of the favorable properties of metallic alloys that polymers lack, such as, for example, excellent mechanical properties and robustness towards wear and adverse surrounding conditions.

Abstract: Micro-emitter arrays and methods of microfabricating such emitter arrays are provided. The microfabricated emitter arrays incorporate a plurality of emitters with heights greater than 280 microns with uniformity of +/?10 microns arranged on a supporting silicon substrate, each emitter comprising an elongated body extending from the top surface of the substrate and incorporating at least one emitter tip on the distal end of the elongated body thereof. The emitters may be disposed on the substrate in an ordered array in an X by Y grid pattern, wherein X and Y can be any number greater than zero. The micro-emitter arrays may utilize a LMIS propellant source including, for example, gallium, indium, bismuth, or tin. The substrate may incorporate at least one through-via providing a fluid pathway for the LMIS propellant to flow from a propellant reservoir beneath the substrate to the top substrate surface whereupon the micro-emitter array is disposed.

Abstract: An endoscope includes a housing with a distal end insertable into a cavity; an image capture device at the distal end to obtain 3D images, and process them to form a video signal; and a folded substrate folded into a U-shape having first and second legs. The image capture device includes a detector and a lens system with right and left multi-band pass filters having right pass bands that are complements of left pass bands. The lens system receives the 3D images including right and left images. The detector faces the lens system to obtain the right and left images. A processing circuit faces the proximal end behind the detector to process signals from the detector. The folded substrate includes the detector at an outer side of the first leg facing the lens system and the processing circuit at an outer side of the second leg facing the proximal end.

Abstract: Micro-emitter arrays and methods of microfabricating such emitter arrays are provided. The microfabricated emitter arrays incorporate a plurality of emitters with heights greater than 280 microns with uniformity of +/?10 microns arranged on a supporting silicon substrate, each emitter comprising an elongated body extending from the top surface of the substrate and incorporating at least one emitter tip on the distal end of the elongated body thereof. The emitters may be disposed on the substrate in an ordered array in an X by Y grid pattern, wherein X and Y can be any number greater than zero. The micro-emitter arrays may utilize a LMIS propellant source including, for example, gallium, indium, bismuth, or tin. The substrate may incorporate at least one through-via providing a fluid pathway for the LMIS propellant to flow from a propellant reservoir beneath the substrate to the top substrate surface whereupon the micro-emitter array is disposed.

Abstract: A dual objective endoscope for insertion into a cavity of a body for providing a stereoscopic image of a region of interest inside of the body including an imaging device at the distal end for obtaining optical images of the region of interest (ROI), and processing the optical images for forming video signals for wired and/or wireless transmission and display of 3D images on a rendering device. The imaging device includes a focal plane detector array (FPA) for obtaining the optical images of the ROI, and processing circuits behind the FPA. The processing circuits convert the optical images into the video signals. The imaging device includes right and left pupil for receiving a right and left images through a right and left conjugated multi-band pass filters. Illuminators illuminate the ROI through a multi-band pass filter having three right and three left pass bands that are matched to the right and left conjugated multi-band pass filters.

Abstract: A deformable mirror is configured to be deformed by surface-parallel actuation. In one embodiment, the deformable mirror includes a first piezoelectric active layer on a first surface of a substrate. The first piezoelectric active layer has a substantially uniform thickness across the first surface of the substrate. The mirror also includes a first electrode layer on the first piezoelectric active layer. The first electrode layer has a plurality of electrodes arranged in a first pattern and has a substantially uniform thickness across the first piezoelectric active layer. The mirror may further include a second piezoelectric layer on the first electrode layer, and a second electrode layer on the second piezoelectric layer. The electrodes of the first and second electrode layers are configured to supply a voltage to the piezoelectric active layers upon actuation to thereby locally deform the shape of the mirror to correct for optical aberrations.

Abstract: A micro-scaled bi-material lattice structure includes a frame comprising a first material having a first coefficient of expansion and defining a plurality of unit cells. The bi-material lattice structure further includes a plurality of plates comprising a second material having a second coefficient of expansion different from the first coefficient of expansion. One of the plates is connected to each unit cell. The bi-material lattice structure has a third coefficient of expansion different from both the first coefficient of the expansion and the second coefficient of expansion, and the bi-material lattice structure has a thickness of about 100 nm to about 3000 microns.

Abstract: A dual objective endoscope for insertion into a cavity of a body for providing a stereoscopic image of a region of interest inside of the body including an imaging device at the distal end for obtaining optical images of the region of interest (ROI), and processing the optical images for forming video signals for wired and/or wireless transmission and display of 3D images on a rendering device. The imaging device includes a focal plane detector array (FPA) for obtaining the optical images of the ROI, and processing circuits behind the FPA. The processing circuits convert the optical images into the video signals. The imaging device includes right and left pupil for receiving a right and left images through a right and left conjugated multi-band pass filters. Illuminators illuminate the ROI through a multi-band pass filter having three right and three left pass bands that are matched to the right and left conjugated multi-band pass filters.

Abstract: The present disclosure is directed, in part, to a method for fabricating a low-stress, ultra-thin membrane as well as the low-stress, ultra-thin membrane formed by this method. The method includes: layering a first layer on a semiconductor substrate; etching a hole in the first layer; layering a second layer on the membrane of the first layer and over the hole; and etching the substrate beginning from the bottom surface thereof, such that at least a portion of the substrate aligned with the hole in the first layer is removed. The first and second layers are made of substantially the same material, which will usually be silicon nitride, however, it is contemplated that other dielectric materials could be used, but it is preferred that the second layer has an amorphous structure. It is preferred that the second layer be formed with a slightly bubble-shape to help deflect stresses on the second layer. Generally, low pressure chemical vapor deposition will be used to create at least the first and second layers.

Abstract: Phase shift masks for X-ray lithography include a carrier with a phase shift feature formed thereon having at least one sharply defined sidewall which is upright with respect to the surface of the carrier. The height of the feature on the phase shift mask is selected such that it provides a phase shift of substantially one-half wavelength of a selected band of the X-rays passed therethrough with respect to the X-rays that are passed through the carrier where there is no phase shift material. The phase shift mask is positioned closely above a target composed of a photoresist on a substrate, and X-rays are then passed therethrough, preferably being provided by synchrotron radiation.