Abstract: In a laser module (310), single-emitter laser diode chips (110) are positioned at different heights on opposite sides of the module's combined output beam (114). Each laser diode chip (110), and its corresponding fast and slow axis collimators (130, 134), and turning mirror (140) are positioned on a corresponding heat-dissipating surface region (340). High thermal stability and output power are obtained in some embodiments even if the modules are combined to obtain higher-level modules (310-2). Other features and embodiments are also provided.

Abstract: In a laser module (310), single-emitter laser diode chips (110) are positioned at different heights on opposite sides of the module's combined output beam (114). Each laser diode chip (110), and its corresponding fast and slow axis collimators (130, 134), and turning mirror (140) are positioned on a corresponding heat-dissipating surface region (340). High thermal stability and output power are obtained in some embodiments even if the modules are combined to obtain higher-level modules (310-2). Other features and embodiments are also provided.

Abstract: Laser diodes (120) emit laser beams along a vertical YZ plane at different distances from the YZ plane. The beams are collimated in their fast and slow axes, and are redirected by turning mirrors (162) to form a beam stack (130C) traveling along the XZ plane. The beam stack is turned by about 90°, then converged by a focusing lens (174) into an optical fiber (180). A compact assembly is thus provided. Each laser diode (120.i), its collimating optics (154.i, 158.i, i=1, 2, . . . ) and its turning mirror (162.i) are rigidly attached to a flat, heat-spreading surface (144.i) and thus remain aligned with each other in thermal cycling.

Abstract: Laser diodes (120) emit laser beams along a vertical YZ plane at different distances from the YZ plane. The beams are collimated in their fast and slow axes, and are redirected by turning mirrors (162) to form a beam stack (130C) traveling along the XZ plane. The beam stack is turned by about 90°, then converged by a focusing lens (174) into an optical fiber (180). A compact assembly is thus provided. Each laser diode (120.i), its collimating optics (154.i, 158.i, i=1,2, . . . ) and its turning mirror (162.i) are rigidly attached to a flat, heat-spreading surface (144.i) and thus remain aligned with each other in thermal cycling.

Abstract: Laser diodes (120) emit laser beams along a vertical YZ plane at different distances from the YZ plane. The beams are collimated in their fast and slow axes, and are redirected by turning mirrors (162) to form a beam stack (130C) traveling along the XZ plane. The beam stack is turned by about 90°, then converged by a focusing lens (174) into an optical fiber (180). A compact assembly is thus provided. Each laser diode (120.i), its collimating optics (154.i, 158.i, i=1, 2, . . . ) and its turning mirror (162.i) are rigidly attached to a flat, heat-spreading surface (144.i) and thus remain aligned with each other in thermal cycling.

Abstract: Laser diodes (120) emit laser beams along a vertical YZ plane at different distances from the YZ plane. The beams are collimated in their fast and slow axes, and are redirected by turning mirrors (162) to form a beam stack (130C) traveling along the XZ plane. The beam stack is turned by about 90°, then converged by a focusing lens (174) into an optical fiber (180). A compact assembly is thus provided. Each laser diode (120.i), its collimating optics (154.i, 158.i, i=1, 2, . . . ) and its turning mirror (162.i) are rigidly attached to a flat, heat-spreading surface (144.i) and thus remain aligned with each other in thermal cycling.

Abstract: A fiber-bundle illumination system of high brightness with reduced optical losses comprises a plurality of light sources that emit lights of different colors and transmit the component lights of different colors to a light mixer through individual optical-fiber light guides assembled into a bundle, which is crimped at least at the inlet and outlet ends. Unique features of the system are optical coupling between the light sources and their respective light guides and mixing colors in a predetermined proportion that results in spatially uniform distribution of the spectrum on the illuminated area. The system may be used in conjunction with optical instruments such as endoscopic cameras, microscopes, etc.

Abstract: An ultra-thin digital imaging device has a thickness of several millimeters and is capable of producing data for creating images of 3 Mp and higher. The device comprises a multi-channel imaging unit that contains a plurality of optical channels formed by microlens objectives and a pixilated image sensor unit with a plurality of sensing elements. Each individual identical image obtained through each optical channel is pixilated and converted into electrical signals that are processed into data sets which can be stored in the imaging device and either reproduced on the display of the device or transmitted to an external image-reproducing device where the obtained data of individual images are transformed into a single, high-resolution megapixel image by means of a technique known in the art.

Abstract: The optical system of the invention is comprised of a monolithic microlens array assembly that consists of two groups of microlenses sub-assemblies having different pitches between the adjacent lenses. A ratio between the pitches of sub-assemblies is determined by a predetermined relationship between the parameters of the optical system so that the microlenses of the first sub-assembly create a plurality of individual intermediate images arranged side-by-side in a common intermediate plane that are transferred by the microlenses of the second sub-assembly to the final image plane in the form of a plurality of identical and accurately registered images interposed onto each other. This is achieved due to the aforementioned ratio between the pitches.

Abstract: The optical system of the invention is comprised of a monolithic microlens array assembly that consists of two groups of microlenses sub-assemblies having different pitches between the adjacent lenses. A ratio between the pitches of sub-assemblies is determined by a predetermined relationship between the parameters of the optical system so that the microlenses of the first sub-assembly create a plurality of individual intermediate images arranged side-by-side in a common intermediate plane that are transferred by the microlenses of the second sub-assembly to the final image plane in the form of a plurality of identical and accurately registered images interposed onto each other. This is achieved due to the aforementioned ratio between the pitches.

Abstract: What is proposed is a heat-transfer interface device for use in a range of up 320° C. working temperatures for transfer of heat from a source of heat to a heat-receiving object under severe conditions. The device comprises an elastomeric material filled with an electrically-nonconductive and thermally-conductive filler material. The elastomeric material may have recesses on the surface or the surface may be curved, e.g., on the side facing the source of heat for forming a space between the surface of the device and the mating surface of the source of heat. The elastomeric material is clamped between the heat source and heat receiver in a compressed state so that when it is expanded under the effect of an increased temperature, the material is redistributed and the recesses are flattened. The elastomeric material comprises perfluoroelastomer polymer, and the filler can be selected from boron nitride, aluminum nitride, beryllium oxide, etc.

Abstract: A thin monolithic image sensor of the invention is comprised of a laminated solid package composed essentially of an optical layer and an image-receiving layer placed on the top of the optical layer. The optical layer also comprises a laminated structure composed of at least an optical microlens-array sublayer and an aperture-array sublayer. The image-receiving layer is a thin flat CCD/CMOS structure that may have a thickness of less than 1 mm. The image digitized by the CCD/CMOS structure of the sensor can be transmitted from the output of the image-receiving layer to a CPU for subsequent processing and, if necessary, for displaying. A distinguishing feature of the sensor of the invention is that the entire sensor along with a light source has a monolithic structure, and that the diaphragm arrays are located in planes different from the plane of the microlens array and provide the most efficient protection against overlapping of images produced by neighboring microlenses.

Abstract: A flat wide-angle lens system of the invention has a reduced axial length and is intended for creating images with extremely wide angle of observation. The system consists of the first component which is intended for reduction of the field angle of light incidence onto the objective and comprises an assembly of at least two microlens arrays with the same pitch between the adjacent microlenses and arranged with respect to each other so as to provide afocality, and a second component that comprises an assembly of conventional spherical or aspherical microlenses that create an image on an image receiver. Each two coaxial microlenses of the microlens arrays of the first component form an inverted microtelescope of Galileo. The outlet aperture of a single microtelescope is made so that spherical aberration can be minimized almost to 0, while field aberrations can be corrected by design parameters of the microlenses.

Abstract: A flat wide-angle lens system of the invention has a reduced axial length and is intended for creating images with extremely wide angle of observation. The system consists of the first component which is intended for reduction of the field angle of light incidence onto the objective and comprises an assembly of at least two microlens arrays with the same pitch between the adjacent microlenses and arranged with respect to each other so as to provide afocality, and a second component that comprises an assembly of conventional spherical or aspherical microlenses that create an image on an image receiver. Each two coaxial microlenses of the microlens arrays of the first component form an inverted microtelescope of Galileo. The outlet aperture of a single microtelescope is made so that spherical aberration can be minimized almost to 0, while field aberrations can be corrected by design parameters of the microlenses.

Abstract: A flat wide-angle objective of the invention consists of a first sub-unit that is located on the object side of the objective and includes an assembly of two conventional aspheric negative, plano-concave lenses, and a second sub-unit in the form of a set of four microlens arrays arranged on the image-receiving side of the objective. The microlenses of all microlens arrays have the same arrangement of microlenses in all the arrays. A diaphragm array with restricting openings can be sandwiched between a pair of the microlens arrays. The invention makes it possible to reduce longitudinal dimension of the objective. In operation, the first sub-unit creates an imaginary image of the object in its focal plane, which is located on object side of the objective, while the second sub-unit creates an actual image of the object in the image plane on the image-receiving side of the objective.

Abstract: A flat wide-angle objective of the invention consists of a first sub-unit that is located on the object side of the objective and comprises an assembly of two conventional aspheric negative, e.g., aspheric piano-concave lenses, and a second sub-unit in the form of a set of four microlens arrays arranged on the image-receiving side of the objective. The microlenses of all microlens arrays have the same arrangement of microlenses in all the arrays. A diaphragm array with restricting openings can be sandwiched between a pair of the microlens arrays. The objective of the invention can be realized into an optimal design only with predetermined relationships between the parameters of the optical system that forms the objective. The invention makes it possible to drastically reduce longitudinal dimension of the objective.

Abstract: What is proposed is a heat-transfer interface device for use in a range of up 320° C. working temperatures for transfer of heat from a source of heat to a heat-receiving object under severe conditions. The device comprises an elastomeric material filled with an electrically-nonconductive and thermally-conductive filler material. The elastomeric material may have recesses on the surface or the surface may be curved, e.g., on the side facing the source of heat for forming a space between the surface of the device and the mating surface of the source of heat. The elastomeric material is clamped between the heat source and heat receiver in a compressed state so that when it is expanded under the effect of an increased temperature, the material is redistributed and the recesses are flattened. The elastomeric material comprises perfluoroelastomer polymer, and the filler can be selected from boron nitride, aluminum nitride, beryllium oxide, etc.