Patents by Inventor Victor Hugo Cruz

Victor Hugo Cruz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Glass/ceramic replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
    Patent number: 9601400
    Abstract: A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: March 21, 2017
    Assignee: Semtech Corporation
    Inventors: Victor Hugo Cruz, David Francis Courtney
  • Glass/Ceramic Replacement of Epoxy for High Temperature Hermetically Sealed Non-Axial Electronic Packages
    Publication number: 20150380333
    Abstract: A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.
    Type: Application
    Filed: August 14, 2015
    Publication date: December 31, 2015
    Inventors: Victor Hugo Cruz, David Francis Courtney
  • Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
    Patent number: 9111869
    Abstract: A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: August 18, 2015
    Assignee: Semtech Corporation
    Inventors: Victor Hugo Cruz, David Francis Courtney