Abstract: An electrode for manipulating an ion beam. The electrode may include an insert having an ion beam aperture to conduct the ion beam therethrough, the insert comprising a first electrically conductive material; a frame disposed around the insert and comprising a second electrically conductive material; and an outer portion, the outer portion disposed around the frame and comprising a third electrically conductive material, wherein the insert is reversibly detachable from the frame, and wherein the frame is reversibly attachable from the outer portion.

Abstract: A load lock and related method of handling a substrate involves placing a substrate onto a vertically movable poppet and moving the poppet between two vertically opposed subchambers such that in moving the poppet toward one of the subchambers, that subchamber is sealed to atmosphere. The two subchamber system allows one substrate to be placed into a buffer and another substrate to be cooled at the same time. Also, the system allows for a slow vacuum to be made on the substrate in a subchamber to avoid undesirably loading the substrate by the otherwise immediate drop in pressure.

Abstract: A dual plate gas assisted heater module having a vertically movable poppet movable between an upper and a lower subchamber has a passive heating feature which preheats a substrate prior to introducing it into a subchamber for active heating.

Abstract: A dual plate gas assisted heater module having a vertically movable poppet movable between an upper and a lower subchamber has a passive heating feature which preheats a substrate prior to introducing it into a subchamber for active heating.

Abstract: A substrate processing apparatus includes a support frame, a substrate transport chamber connected to the support frame, and a substrate transfer robot located at least partially in the substrate transport chamber. The support frame includes a first section directly connected to the substrate transport chamber, and a second section directly connected to the substrate transfer robot. The second section is separate from the first section and includes mounting arms having leveling points. The leveling points support the substrate transfer robot and align the robot relative to the transport chamber. Further, the substrate transport chamber includes a wall having an aperture. The substrate transfer robot is located in the aperture. A flexible coupling flange is mounted between the wall of the substrate transport chamber and the substrate transfer robot. The flexible coupling flange seals a portion of the aperture between the wall and the substrate transfer robot.