Abstract: A press including a passive load leveler for bonding integrated circuit wafers, chips or substrates. The press includes a press frame, a press ram moveable relative to the frame, a first platen coupled to the press ram, and a second platen coupled to the press frame. The load leveler is coupled between the press frame and the second platen, and includes a main body having a first surface coupled to the press frame a plurality of pistons extending from the main body through a second surface and being in contact with the second platen. Each of the pistons is positioned within a piston chamber that is in fluid communication with a network of channels within the main body, where the pistons move relative to each other through a working fluid within the channels so as to maintain the first and second platens parallel to each other under the ram pressure.

Abstract: Semiconductor wafer (11) are uniformly and thoroughly cleaned of particulate and organic contaminants by sweeping the wafer with a hydraulic broom that sprays cleaning solution onto the wafer. The broom contains an aspirating nozzle (3) for connection to a source of pressurized gas, such as nitrogen, and to a source of cleaning fluid, such as acetone, wherein cleaning fluid aspirated by the gas stream is expressed through the nozzle outlet to impact the surface of the wafer, dislodging particulate matter and dissolving organic contaminants. A programmed controller (9) controls movement of the hydraulic broom relative to the wafer to ensure that the entire surface is cleaned and permits a variety of sweeping patterns.

Abstract: Semiconductor wafer (11) are uniformly and thoroughly cleaned of particulate and organic contaminants by sweeping the wafer with a hydraulic broom that sprays cleaning solution onto the wafer. The broom contains an aspirating nozzle (3) for connection to a source of pressurized gas, such as nitrogen, and to a source of cleaning fluid, such as acetone, wherein cleaning fluid aspirated by the gas stream is expressed through the nozzle outlet to impact the surface of the wafer, dislodging particulate matter and dissolving organic contaminants. A programmed controller (9) controls movement of the hydraulic broom relative to the wafer to ensure that the entire surface is cleaned and permits a variety of sweeping patterns.

Abstract: An improved millimeter wave device package design in which the package includes a dielectric substrate disposed upon a supporting base such that the substrate extends substantially along the peripheral edge of the base, defining a central aperture. A solid conductive layer substantially covers the first surface of the dielectric substrate and a series of conductive transmission lines are formed on an opposing second surface of the substrate. A dielectric layer is disposed upon and substantially covers the transmission lines and the second surface of the substrate upon which they are formed. A seal ring is disposed upon and the dielectric layer and a conductor electrically connects the device to the transmission lines. A lid is sealed atop the seal ring completes the hermetical seal for the device.

Abstract: A hermetically sealable millimeter waveguide launch transition feedthrough for channelling high frequency electrical signals in a circuit which includes at least one waveguide. An aperture is formed in one wall of the waveguide and a conductive pin passes through the aperture. The pin is sealed therein by a dielectric material which surrounds the pin so as to isolate it from the waveguide wall. A probe head is disposed at one end of the conductive pin and within the waveguide. The opposite end of the pin contains a second probe head or other circuit connector. The transition may be effectively implemented in waveguide-to-waveguide or waveguide-to-device applications as well as in colinear device housing applications.