Patents by Inventor Victor Kheil

Victor Kheil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Folded fin heat sink assembly
    Publication number: 20050133198
    Abstract: A folded fin heat sink assembly and a method of fabricating a folded fin heat sink assembly for use as a cooling solution in micro-electronics and/or telecommunication applications. The heat sink assembly is formed by placing a sheet or paste of Sn—Zn solder upon a copper base plate, placing one or more aluminum folded fin assemblies on the solder sheet or paste, heating the base plate, the folded fin assembly and the solder to a temperature exceeding the liquidus temperature of the solder and allowing the solder to flow, and cooling the solder to form a soldered joint between the base plate and the folded fin assembly.
    Type: Application
    Filed: August 26, 2004
    Publication date: June 23, 2005
    Inventors: Ross Armstrong, Alin Ila, Victor Kheil
  • Folded fin heat sink assembly
    Patent number: 6793011
    Abstract: A folded fin heat sink assembly and a method of fabricating a folded fin heat sink assembly for use as a cooling solution in micro-electronics and/or telecommunication applications. The heat sink assembly is formed by placing a sheet or paste of Sn—Zn solder upon a copper base plate, placing one or more aluminum folded fin assemblies on the solder sheet or paste, heating the base plate, the folded fin assembly and the solder to a temperature exceeding the liquidus temperature of the solder and allowing the solder to flow, and cooling the solder to form a soldered joint between the base plate and the folded fin assembly.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: September 21, 2004
    Assignee: ATS Automation Tooling Systems Inc.
    Inventors: Ross D. Armstrong, Alin Lla, Victor Kheil
  • Folded fin heat sink assembly
    Publication number: 20020139833
    Abstract: A folded fin heat sink assembly and a method of fabricating a folded fin heat sink assembly for use as a cooling solution in micro-electronics and/or telecommunication applications. The heat sink assembly is formed by placing a sheet or paste of Sn—Zn solder upon a copper base plate, placing one or more aluminum folded fin assemblies on the solder sheet or paste, heating the base plate, the folded fin assembly and the solder to a temperature exceeding the liquidus temperature of the solder and allowing the solder to flow, and cooling the solder to form a soldered joint between the base plate and the folded fin assembly.
    Type: Application
    Filed: February 14, 2002
    Publication date: October 3, 2002
    Inventors: Ross D. Armstrong, Alin Ila, Victor Kheil