Patents by Inventor VICTOR KUCHEROV

VICTOR KUCHEROV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11710616
    Abstract: A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: July 25, 2023
    Inventors: Vladimir Machavariani, Michael Shifrin, Daniel Kandel, Victor Kucherov, Igor Ziselman, Ronen Urenski, Matthew Sendelbach
  • Publication number: 20230074398
    Abstract: A metrology method for use in determining one or more parameters of a patterned structure, the method including providing raw measured TEM image data, TEMmeas, data indicative of a TEM measurement mode, and predetermined simulated TEM image data including data indicative of one or more simulated TEM images of a structure similar to the patterned structure under measurements and a simulated weight map including weights assigned to different regions in the simulated TEM image corresponding to different features of the patterned structure, performing a fitting procedure between the raw measured TEM image data and the predetermined simulated TEM image data and determining one or more parameters of the structure from the simulated TEM image data corresponding to a best fit condition.
    Type: Application
    Filed: September 19, 2022
    Publication date: March 9, 2023
    Inventors: VLADIMIR MACHAVARIANI, MICHAEL SHIFRIN, DANIEL KANDEL, VICTOR KUCHEROV, IGOR ZISELMAN, RONEN URENSKI, MATTHEW SENDELBACH
  • Publication number: 20220310356
    Abstract: A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.
    Type: Application
    Filed: April 18, 2022
    Publication date: September 29, 2022
    Inventors: VLADIMIR MACHAVARIANI, MICHAEL SHIFRIN, DANIEL KANDEL, VICTOR KUCHEROV, IGOR ZISELMAN, RONEN URENSKI, MATTHEW SENDELBACH
  • Patent number: 11450541
    Abstract: A metrology method for use in determining one or more parameters of a patterned structure, the method including providing raw measured TEM image data, TEMmeas, data indicative of a TEM measurement mode, and predetermined simulated TEM image data including data indicative of one or more simulated TEM images of a structure similar to the patterned structure under measurements and a simulated weight map including weights assigned to different regions in the simulated TEM image corresponding to different features of the patterned structure, performing a fitting procedure between the raw measured TEM image data and the predetermined simulated TEM image data and determining one or more parameters of the structure from the simulated TEM image data corresponding to a best fit condition.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: September 20, 2022
    Assignee: NOVA LTD
    Inventors: Vladimir Machavariani, Michael Shifrin, Daniel Kandel, Victor Kucherov, Igor Ziselman, Ronen Urenski, Matthew Sendelbach
  • Patent number: 11309162
    Abstract: A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: April 19, 2022
    Assignee: NOVA LTD
    Inventors: Vladimir Machavariani, Michael Shifrin, Daniel Kandel, Victor Kucherov, Igor Ziselman, Ronen Urenski, Matthew Sendelbach
  • Publication number: 20210217581
    Abstract: A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.
    Type: Application
    Filed: February 9, 2021
    Publication date: July 15, 2021
    Inventors: VLADIMIR MACHAVARIANI, MICHAEL SHIFRIN, DANIEL KANDEL, VICTOR KUCHEROV, IGOR ZISELMAN, RONEN URENSKI, MATTHEW SENDELBACH
  • Patent number: 10916404
    Abstract: A control system is presented for use in measuring one or more parameters of a three-dimensional patterned structure. The control system is configured as a computer system comprising a data processor configured to receive and process raw measured TEM image data, TEMmeas, and generate output data indicative of one or more parameters of a patterned structure. The data processor comprises an optimization module configured and operable to utilize data indicative of one or more parameters of TEM measurement mode and perform a fitting procedure between the raw measured TEM image data, TEMmeas, and a predetermined simulated TEM image data, TEMsimui based on a parametrized three-dimensional model of features of the patterned structure, and generate simulated image data corresponding to a best fit condition, to thereby enable determination therefrom of the one or more parameters of the structure.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: February 9, 2021
    Assignee: NOVA MEASURING INSTRUMENTS LTD.
    Inventors: Vladimir Machavariani, Michael Shifrin, Daniel Kandel, Victor Kucherov, Igor Ziselman, Ronen Urenski, Matthew Sendelbach
  • Publication number: 20200294829
    Abstract: A control system for use in measuring one or more parameters of a patterned structure. The control system is configured as a computer system and comprises: an input utility configured to receive input data comprising raw measured TEM image data, TEMmeas, data indicative of a TEM measurement mode; and a data processor configured to process the raw measured TEM image data, TEMmeas, and generate output data indicative of one or more parameters of a patterned structure. The data processor comprises an optimization module configured and operable to utilize the data indicative of the TEM measurement mode and perform a fitting procedure between the raw measured TEM image data, TEMmeas, and predetermined simulated TEM image data, TEMsimul, and determine one or more parameters of the structure from the simulated image data corresponding to a best fit condition.
    Type: Application
    Filed: August 29, 2018
    Publication date: September 17, 2020
    Inventors: VLADIMIR MACHAVARIANI, MICHAEL SHIFRIN, DANIEL KANDEL, VICTOR KUCHEROV, IGOR ZISELMAN, RONEN URENSKI, MATTHEW SENDELBACH
  • Publication number: 20190393016
    Abstract: A control system is presented for use in measuring one or more parameters of a three-dimensional patterned structure. The control system is configured as a computer system comprising a data processor configured to receive and process raw measured TEM image data, TEMmeas, and generate output data indicative of one or more parameters of a patterned structure. The data processor comprises an optimization module configured and operable to utilize data indicative of one or more parameters of TEM measurement mode and perform a fitting procedure between the raw measured TEM image data, TEMmeas, and a predetermined simulated TEM image data, TEMsimui based on a parametrized three-dimensional model of features of the patterned structure, and generate simulated image data corresponding to a best fit condition, to thereby enable determination therefrom of the one or more parameters of the structure.
    Type: Application
    Filed: February 27, 2018
    Publication date: December 26, 2019
    Inventors: VLADIMIR MACHAVARIANI, MICHAEL SHIFRIN, DANIEL KANDEL, VICTOR KUCHEROV, IGOR ZISELMAN, RONEN URENSKI, MATTHEW SENDELBACH