Abstract: A heat sink adapted for use with VLSI and other integrated circuit elements which includes a base adapted to be in thermal contact with the element to be cooled, there preferably being at least one projection from the side of the base adapted to be adjacent to the element, and a plurality of pins extending from the other side of the base in a direction substantially perpendicular thereto. The projection from the base may either be in the form of a center pedestal which is secured to the element to be cooled by a suitable adhesive, limiting the thermal stress area, or may be a plurality of projections formed in a predetermined pattern which are adapted to be in physical contact with the element and to provide a controlled standoff therefrom which defines a uniform adhesive bond line. The heat sink also preferably provides a means for reducing the temperature gradient between the center pins and peripheral pins which results from the center of the integrated circuit typically being hotter than the outer areas.