Abstract: An electroded wafer for use in electro-optic devices comprising a ceramic wafer having piezoelectric properties and having faces substantially larger than the thickness of the wafer. On the wafer are a plurality of parallel slots cut in at least one face of said wafer to form an interdigital matrix wherein adjacent slots are cut through the periphery of the wafer at opposite ends. Further included is a metallic electrode plated on the interior of the slots and the periphery of the wafer by electroless plating of at least one metal in contact with a palladium catalyzing compound such that the catalyzing compound is present only on the portions of the wafer to be plated.

Abstract: An electroded wafer for use in electro-optic devices comprising a ceramic wafer having piezoelectric properties and having faces substantially larger than the thickness of the wafer. On the wafer are a plurality of parallel slots cut in at least one face of said wafer to form an interdigital matrix wherein adjacent slots are cut through the periphery of the wafer at opposite ends. Further included is a metallic electrode plated on the interior of the slots and the periphery of the wafer by electroless plating of at least one metal in contact with a palladium catalyzing compound such that the catalyzing compound is present only on the portions of the wafer to be plated.

Abstract: Improvements are disclosed in the method of electroless deposition of a metal on a nonconductive surface wherein the surface is sequentially contacted with a tin salt solution, a palladium salt solution, and an electroless plating bath containing said metal. The improvement relates to preparing the surface to produce an unbroken layer of water adhering thereto upon dipping said surface in deionized water. The improvement further contemplates removing the surface from the electroless plating bath after formation of the visible amount of metal, inspecting the surface for imperfections, removing the metal, and recleaning the surface to remove imperfections. Finally, the activation steps are repeated followed by contacting the surface with an electroless plating bath to plate the desired quantity of metal thereon in a manner wherein uniformity and adhesion are improved.