Patents by Inventor Victor R. Miller

Victor R. Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device and method for preventing magnetic-resonance imaging induced damage
    Patent number: 8323768
    Abstract: An electromagnetic shield has a first patterned or apertured layer having non-conductive materials and conductive material and a second patterned or apertured layer having non-conductive materials and conductive material. The conductive material may be a metal, a carbon composite, or a polymer composite. The non-conductive materials in the first patterned or apertured layer may be randomly located or located in a predetermined segmented pattern such that the non-conductive materials in the first patterned or apertured layer are located in a predetermined segmented pattern with respect to locations of the non-conductive materials in the second patterned or apertured layer.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: December 4, 2012
    Assignee: Medtronic, Inc.
    Inventors: Patrick R. Connelly, Michael L. Weiner, Victor R. Miller, Jeffrey L. Helfer
  • Device and method for preventing magnetic-resonance imaging induced damage
    Patent number: 7738942
    Abstract: An electromagnetic shield has a first patterned or apertured layer having non-conductive materials and conductive material and a second patterned or apertured layer having non-conductive materials and conductive material. The conductive material may be a metal, a carbon composite, or a polymer composite. The non-conductive materials in the first patterned or apertured layer may be randomly located or located in a predetermined segmented pattern such that the non-conductive materials in the first patterned or apertured layer are located in a predetermined segmented pattern with respect to locations of the non-conductive materials in the second patterned or apertured layer.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: June 15, 2010
    Assignee: Medtronic, Inc.
    Inventors: Michael L. Weiner, Victor R. Miller, Patrick R. Connelly, Jeffrey L. Helfer
  • Device and method for preventing magnetic-resonance imaging induced damage
    Patent number: 7015393
    Abstract: An electromagnetic shield has a first patterned or apertured layer having non-conductive materials and conductive material and a second patterned or apertured layer having non-conductive materials and conductive material. The conductive material may be a metal, a carbon composite, or a polymer composite. The non-conductive materials in the first patterned or apertured layer may be randomly located or located in a predetermined segmented pattern such that the non-conductive materials in the first patterned or apertured layer are located in a predetermined segmented pattern with respect to locations of the non-conductive materials in the second patterned or apertured layer.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: March 21, 2006
    Assignee: Biophan Technologies, Inc.
    Inventors: Michael L. Weiner, Victor R. Miller, Patrick R. Connelly, Jeffrey L. Helfer
  • Device and method for preventing magnetic-resonance imaging induced damage
    Publication number: 20040251042
    Abstract: An electromagnetic shield has a first patterned or apertured layer having non-conductive materials and conductive material and a second patterned or apertured layer having non-conductive materials and conductive material. The conductive material may be a metal, a carbon composite, or a polymer composite. The non-conductive materials in the first patterned or apertured layer may be randomly located or located in a predetermined segmented pattern such that the non-conductive materials in the first patterned or apertured layer are located in a predetermined segmented pattern with respect to locations of the non-conductive materials in the second patterned or apertured layer.
    Type: Application
    Filed: March 8, 2004
    Publication date: December 16, 2004
    Applicant: Biophan Technologies, Inc.
    Inventors: Michael L. Weiner, Victor R. Miller, Patrick R. Connelly, Jeffrey L. Helfer