Abstract: A switch matrix 10 is provided comprising a plurality of input modules X and a plurality of output modules P. Each input module 16 has a plurality of first input interconnections 14, a plurality of first interconnected switches 21, and a plurality of first output interconnections 20. Each output module 18 has a plurality of second input interconnections 23, a plurality of second interconnected switches 24, and a plurality of second output interconnections 20. The plurality of input modules X is electrically coupled to the plurality of output modules P, forming a plurality of signal paths 12 having a plurality of interconnected switches K per signal path 12. A method is also provided minimizing the total number of interconnected switches Z within the switch matrix 10 for a particular application. The method comprises determining switch matrix design requirements, calculating the values of X and P, and performing an integer partitioning process.

Abstract: A switch matrix 10 is provided comprising a plurality of input modules X and a plurality of output modules P. Each input module 16 has a plurality of first input interconnections 14, a plurality of first interconnected switches 21, and a plurality of first output interconnections 20. Each output module 18 has a plurality of second input interconnections 23, a plurality of second interconnected switches 24, and a plurality of second output interconnections 20. The plurality of input modules X is electrically coupled to the plurality of output modules P, forming a plurality of signal paths 12 having a plurality of interconnected switches K per signal path 12. A method is also provided minimizing the total number of interconnected switches Z within the switch matrix 10 for a particular application. The method comprises determining switch matrix design requirements, calculating the values of X and P, and performing an integer partitioning process.

Abstract: A thermal probe (10) for averaging temperature fluctuations over a prolonged period is formed with a temperature sensor (22) embedded inside a solid object (12) of a thermally conducting material. The solid object is held in a position equidistantly spaced apart from the interior surfaces of a closed housing (16) by a mount (14) made of a thermally insulating material. The housing is sealed to trap a vacuum or mass of air inside and thereby prevent transfer of heat directly between the environment outside of the housing and the solid object. Electrical leads (24) couple the temperature sensor with a connector (26) on the outside of the housing. Other solid objects of different sizes and materials may be substituted for the cylindrically-shaped object to vary the time constant of the probe.