Abstract: A method for detecting electrical disconnections of a chip during testing under environmental conditions includes providing n monitor connections on a chip from which a voltage or current can be sensed during testing of the chip under environmental conditions, where n is an integer of at least one. M sensing connections are provided on the chip, where m>n. An electrical circuit for electrically connects the n monitor connections with the m sensing connections. The electrical circuit has a characteristic that changes when one or more of the m sensing connections is disconnected from its corresponding contact on the printed circuit board or chip socket. The electrical circuit is monitored via the n monitor connections during the testing. It is determined based on changes in the characteristic, whether one or more of the m sensing connections is disconnected from the printed circuit board or chip socket.

Abstract: A cross-bar unit for a test apparatus for circuit boards having at least one cross-bar spanning a test field in which a circuit board to be tested may be placed, and is configured to hold positioning units for test fingers in a linearly traversable manner so that the test fingers are able to scan at least part of the test field. The cross-bar unit is configured to hold at least two linear guides, independent of one another, for guiding in each case at least one of the positioning units.

Abstract: A device and method of determining the electrical properties of an electrical device, including taking of at least one measurement of an electrical measured quantity at one or more brought-out electrical connections of each of several equipotential bodies of the electrical device, wherein measurement of the electrical measured quantity of certain equipotential bodies on at least one other brought-out electrical connection of the equipotential body concerned is not performed if a defect, which if appropriate is to be detected, of the relevant equipotential body in the area of this other connection, influences the electrical measured quantity more strongly than a tolerance of the measurement of this measured quantity.

Abstract: The invention relates to a linear motor for a device for testing a printed circuit board. The linear motor comprises a stator and a rotor, wherein the stator comprises a row of permanent magnets arranged side by side and alternating in their polarity, and wherein the rotor is formed from a printed circuit board on which conductor paths form magnet coils arranged side by side and each having several windings, which magnet coils, when carrying a current, apply a linear acceleration force to the rotor, so that the rotor is moved relative to the stator, wherein the printed circuit board is folded, so that the several windings of each magnet coil are distributed among several layers of the printed circuit board, which are placed on top of one another by folding the printed circuit board.

Abstract: The invention relates to a method for the testing of circuit boards using a testing apparatus which has a test set-up for contacting the circuit board test points of a circuit board to be tested. The test set-up has test contact elements in a predetermined regular grid.

Abstract: To determine electrical properties of an electrical device (10), in each case one measurement (110) of an electrical measured quantity is made on at least one brought-out electrical connection (46, 48) of one of several equipotential bodies (20, 26) of the electrical device (10). The measurement (110) of the electrical measured quantity of certain equipotential bodies (20) is not performed on at least one other brought-out electrical connection (46) of the equipotential body (20) concerned if a defect, which is if appropriate to be detected, of the relevant equipotential body (20) in the area of this other connection (60), influences the electrical measured quantity (C) more strongly than a tolerance of the measurement of this measured quantity (C).

Abstract: A module for a tester for the testing of circuit boards is described. Such testers have a basic grid on which an adapter and/or a translator may be arranged in order to connect contact points of the basic grid with circuit board test points of a circuit board to be tested. The module comprises a support plate and a contact board. The contact board is formed by a rigid circuit board section which is described as the basic grid element, and at least one flexible circuit board section. Provided on the basic grid element are contact points which each form part of the contact points of the basic grid. The basic grid element is mounted at an end face of the support plate, and the flexible circuit board section is bent in such a way that at least part of the other section of the contact board is parallel to the support plate.

Abstract: A finger tester for testing non-componented printed circuit boards uses two or more test fingers, each having a test probe. A detection device is provided above each test probe for optical detection of the position above the circuit board of at least one contact tip of the test probe. The detection devices of the test fingers are each arranged in different vertically spaced planes, so that areas of the detection devices located above the test fingers are positioned above one another, aligned vertically to prevent contact during testing.

Abstract: The invention relates to a method and a device for the testing of noncomponented circuit boards. The method according to the invention is used to determine deviations of circuit board test points of a series of circuit boards from the CAD data relating to these circuit boards, by scanning the surface of the circuit board by an imaging method and subjecting this image to automatic image analysis so that it may be compared with the CAD data. The CAD data are then suitably corrected so that, with the aid of the corrected CAD data, the circuit board may be tested in a finger tester, with test fingers of the finger tester being controlled on the basis of the deviations found.

Abstract: The present invention relates to a finger tester for the testing of non-componented printed circuit boards using at least two test fingers (1), each of which has a test probe (2), and wherein there is provided above each test probe (2) a detection device (20) for optical detection of the position of at least one contact tip of the test probe (2). The detection devices (20) of the two or more test fingers (1) are arranged in different vertically spaced planes, so that at least areas of the detection devices (20) located above the test finger (1) may be positioned above one another, aligned vertically without contact.

Abstract: The method according to the invention is used to determine deviations of circuit board test points of a series of circuit boards from the CAD data relating to these circuit boards, by scanning the surface of the circuit board by an imaging method and subjecting this image to automatic image analysis so that it may be compared with the CAD data. The CAD data are then suitably corrected so that, with the aid of the corrected CAD data, the circuit board may be tested in a finger tester, with test fingers of the finger tester being controlled on the basis of the deviations found.

Abstract: A test probe for a finger tester for the testing of non-componented circuit boards has a test needle with a probe tip which may be brought into contact with a circuit board test point, and which may be pivotably attached to a mount by means of at least two flexible sprung retaining arms. It is distinguished by the fact that at least one of the retaining arms is made of an electrically conductive material and is electrically connected to the test needle. In a corresponding finger tester, the test probe is driven by a linear motor.

Abstract: A method of testing circuit boards, in particular non-componented circuit boards in which the level of the surface of a circuit board to be tested is detected automatically in a contacting process, and the further contacting operations are then controlled on the basis of the level detected. By this process, the control of the movement of the test probes of the finger tester effects automatic matching to the level, which is of particular advantage in the testing of flexible circuit boards, since their surface may have a three-dimensional form.

Abstract: A test probe for a finger tester for the testing of non-componented circuit boards has a test needle with a probe tip which may be brought into contact with a circuit board test point, and which may be pivotably attached to a mount by means of at least two flexible sprung retaining arms. It is distinguished by the fact that at least one of the retaining arms is made of an electrically conductive material and is electrically connected to the test needle. In a corresponding finger tester, the test probe is driven by a linear motor.

Abstract: A test probe for a finger tester for the testing of non-componented circuit boards has a test needle with a probe tip which may be brought into contact with a circuit board test point, and which may be pivotably attached to a mount by means of at least two flexible sprung retaining arms. It is distinguished by the fact that at least one of the retaining arms is made of an electrically conductive material and is electrically connected to the test needle. In a corresponding finger tester, the test probe is driven by a linear motor.

Abstract: A test probe for a finger tester for the testing of non-componented circuit boards has a test needle with a probe tip which may be brought into contact with a circuit board test point, and which may be pivotably attached to a mount by means of at least two flexible sprung retaining arms. It is distinguished by the fact that at least one of the retaining arms is made of an electrically conductive material and is electrically connected to the test needle. In a corresponding finger tester, the test probe is driven by a linear motor.

Abstract: A method of testing circuit boards, in particular non-componented circuit boards in which the level of the surface of a circuit board to be tested is detected automatically in a contacting process, and the further contacting operations are then controlled on the basis of the level detected. By this means, the control of the movement of the test probes of the finger tester effects automatic matching to the level, which is of particular advantage in the testing of flexible circuit boards, since their surface may have a three-dimensional form.

Abstract: A test probe for a finger tester for the testing of non-componented circuit boards has a test needle with a probe tip which may be brought into contact with a circuit board test point, and which may be pivotably attached to a mount by means of at least two flexible sprung retaining arms. It is distinguished by the fact that at least one of the retaining arms is made of an electrically conductive material and is electrically connected to the test needle. In a corresponding finger tester, the test probe is driven by a linear motor.

Abstract: A test probe for a finger tester for the testing of non-componented circuit boards has a test needle with a probe tip which may be brought into contact with a circuit board test point, and which may be pivotably attached to a mount by means of at least two flexible sprung retaining arms. It is distinguished by the fact that at least one of the retaining arms is made of an electrically conductive material and is electrically connected to the test needle. In a corresponding finger tester, the test probe is driven by a linear motor.

Abstract: A test probe for a finger tester for the testing of non-componented circuit boards has a test needle with a probe tip which may be brought into contact with a circuit board test point, and which may be pivotably attached to a mount by means of at least two flexible sprung retaining arms. It is distinguished by the fact that at least one of the retaining arms is made of an electrically conductive material and is electrically connected to the test needle. In a corresponding finger tester, the test probe is driven by a linear motor.